IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | XNOR GATE |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | MIL-STD-883 Class C |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DM54ALS810J/883C | DM54ALS810J/883 | DM74ALS810M/A+ | DM74ALS810M/B+ | DM74ALS810N/A+ | DM74ALS810N/B+ | |
|---|---|---|---|---|---|---|
| Description | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,SOP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT XNOR,ALS-TTL,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | compliant | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | SOP | SOP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| Schmitt trigger | NO | NO | NO | NO | NO | NO |
| surface mount | NO | NO | YES | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| package instruction | - | - | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 |
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