LS SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Parts packaging code | DIP |
package instruction | CERAMIC, DIP-14 |
Contacts | 14 |
Reach Compliance Code | not_compliant |
series | LS |
JESD-30 code | R-GDIP-T14 |
JESD-609 code | e0 |
Load capacitance (CL) | 15 pF |
Logic integrated circuit type | AND GATE |
MaximumI(ol) | 0.008 A |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 14 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Maximum supply current (ICC) | 8.8 mA |
Prop。Delay @ Nom-Sup | 20 ns |
propagation delay (tpd) | 15 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Base Number Matches | 1 |
T74LS08D1 | T74LS08C1 | T74LS08B1 | T74LS08M1 | |
---|---|---|---|---|
Description | LS SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 | LS SERIES, QUAD 2-INPUT AND GATE, PQCC20, PLASTIC, LCC-20 | LS SERIES, QUAD 2-INPUT AND GATE, PDIP14, PLASTIC, DIP-14 | LS SERIES, QUAD 2-INPUT AND GATE, PDSO14, MICRO, SO-14 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Parts packaging code | DIP | QLCC | DIP | SOIC |
package instruction | CERAMIC, DIP-14 | PLASTIC, LCC-20 | PLASTIC, DIP-14 | MICRO, SO-14 |
Contacts | 14 | 20 | 14 | 14 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
series | LS | LS | LS | LS |
JESD-30 code | R-GDIP-T14 | S-PQCC-J20 | R-PDIP-T14 | R-PDSO-G14 |
JESD-609 code | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 15 pF | 15 pF | 15 pF | 15 pF |
Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE |
MaximumI(ol) | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
Number of functions | 4 | 4 | 4 | 4 |
Number of entries | 2 | 2 | 2 | 2 |
Number of terminals | 14 | 20 | 14 | 14 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | QCCJ | DIP | SOP |
Encapsulate equivalent code | DIP14,.3 | LDCC20,.4SQ | DIP14,.3 | SOP14,.25 |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V |
Maximum supply current (ICC) | 8.8 mA | 8.8 mA | 8.8 mA | 8.8 mA |
Prop。Delay @ Nom-Sup | 20 ns | 20 ns | 20 ns | 20 ns |
propagation delay (tpd) | 15 ns | 15 ns | 15 ns | 15 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | NO | NO | NO | NO |
Maximum seat height | 5.08 mm | 4.57 mm | 5.1 mm | 1.75 mm |
Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | YES |
technology | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 8.9662 mm | 7.62 mm | 3.9 mm |
Base Number Matches | 1 | 1 | 1 | 1 |