LS SERIES, QUAD 2-INPUT AND GATE, PDSO14, MICRO, SO-14
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | SOIC |
| package instruction | MICRO, SO-14 |
| Contacts | 14 |
| Reach Compliance Code | not_compliant |
| series | LS |
| JESD-30 code | R-PDSO-G14 |
| JESD-609 code | e0 |
| length | 8.65 mm |
| Load capacitance (CL) | 15 pF |
| Logic integrated circuit type | AND GATE |
| MaximumI(ol) | 0.008 A |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP14,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 8.8 mA |
| Prop。Delay @ Nom-Sup | 20 ns |
| propagation delay (tpd) | 15 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 1.75 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.9 mm |
| Base Number Matches | 1 |
| T74LS08M1 | T74LS08C1 | T74LS08B1 | T74LS08D1 | |
|---|---|---|---|---|
| Description | LS SERIES, QUAD 2-INPUT AND GATE, PDSO14, MICRO, SO-14 | LS SERIES, QUAD 2-INPUT AND GATE, PQCC20, PLASTIC, LCC-20 | LS SERIES, QUAD 2-INPUT AND GATE, PDIP14, PLASTIC, DIP-14 | LS SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | SOIC | QLCC | DIP | DIP |
| package instruction | MICRO, SO-14 | PLASTIC, LCC-20 | PLASTIC, DIP-14 | CERAMIC, DIP-14 |
| Contacts | 14 | 20 | 14 | 14 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| series | LS | LS | LS | LS |
| JESD-30 code | R-PDSO-G14 | S-PQCC-J20 | R-PDIP-T14 | R-GDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 15 pF | 15 pF | 15 pF | 15 pF |
| Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE |
| MaximumI(ol) | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| Number of functions | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 20 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | SOP | QCCJ | DIP | DIP |
| Encapsulate equivalent code | SOP14,.25 | LDCC20,.4SQ | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 8.8 mA | 8.8 mA | 8.8 mA | 8.8 mA |
| Prop。Delay @ Nom-Sup | 20 ns | 20 ns | 20 ns | 20 ns |
| propagation delay (tpd) | 15 ns | 15 ns | 15 ns | 15 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO |
| Maximum seat height | 1.75 mm | 4.57 mm | 5.1 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 3.9 mm | 8.9662 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD