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5962-8959837MNA

Description
Standard SRAM, 128KX8, 25ns, CMOS, CQCC32, 0.450 X 0.700 INCH, CERAMIC, LCC-32
Categorystorage    storage   
File Size684KB,9 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
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5962-8959837MNA Overview

Standard SRAM, 128KX8, 25ns, CMOS, CQCC32, 0.450 X 0.700 INCH, CERAMIC, LCC-32

5962-8959837MNA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerLOGIC Devices
Parts packaging codeQFJ
package instructionQCCN, LCC32,.45X.7
Contacts32
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time25 ns
Other featuresAUTOMATIC POWER-DOWN
I/O typeCOMMON
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length17.78 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.45X.7
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height2.54 mm
Maximum standby current0.01 A
Minimum standby current2 V
Maximum slew rate0.14 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb) - hot dipped
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm
Base Number Matches1

5962-8959837MNA Related Products

5962-8959837MNA 5962-8959829MYC 5962-8959829MNC 5962-8959831MYA L7C109YMB25
Description Standard SRAM, 128KX8, 25ns, CMOS, CQCC32, 0.450 X 0.700 INCH, CERAMIC, LCC-32 Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32 Standard SRAM, 128KX8, 25ns, CMOS, CQCC32, 0.450 X 0.700 INCH, CERAMIC, LCC-32 Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32 Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32
Parts packaging code QFJ SOJ QFJ SOJ SOJ
package instruction QCCN, LCC32,.45X.7 0.440 INCH, CERAMIC, SOJ-32 QCCN, LCC32,.45X.7 0.440 INCH, CERAMIC, SOJ-32 0.440 INCH, CERAMIC, SOJ-32
Contacts 32 32 32 32 32
Reach Compliance Code unknown compliant unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 25 ns 25 ns 25 ns 25 ns 25 ns
Other features AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN
JESD-30 code R-CQCC-N32 R-CDSO-J32 R-CQCC-N32 R-CDSO-J32 R-CDSO-J32
length 17.78 mm 20.9804 mm 17.78 mm 20.9804 mm 20.9804 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of ports 1 1 1 1 1
Number of terminals 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES NO NO YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN SOJ QCCN SOJ SOJ
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER SMALL OUTLINE CHIP CARRIER SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 38535Q/M;38534H;883B
Maximum seat height 2.54 mm 4.191 mm 2.54 mm 4.191 mm 4.191 mm
Minimum standby current 2 V 2 V 2 V 2 V 2 V
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form NO LEAD J BEND NO LEAD J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD DUAL QUAD DUAL DUAL
width 11.43 mm 10.9093 mm 11.43 mm 10.9093 mm 10.9093 mm
Base Number Matches 1 1 1 1 1
Is it lead-free? Contains lead Contains lead - - Contains lead
Is it Rohs certified? incompatible incompatible incompatible - incompatible
Maker LOGIC Devices - - LOGIC Devices LOGIC Devices
I/O type COMMON COMMON COMMON - COMMON
JESD-609 code e0 - e4 e0 e0
Humidity sensitivity level 3 1 3 - 3
Encapsulate equivalent code LCC32,.45X.7 SOJ32,.44 LCC32,.45X.7 - SOJ32,.44
Peak Reflow Temperature (Celsius) 225 225 - - 225
power supply 5 V 5 V 5 V - 5 V
Maximum standby current 0.01 A 0.001 A 0.01 A - 0.001 A
Maximum slew rate 0.14 mA 0.145 mA 0.14 mA - 0.145 mA
Terminal surface Tin/Lead (Sn/Pb) - hot dipped - Gold (Au) TIN LEAD Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED
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