|
5962-8959837MNA |
5962-8959829MYC |
5962-8959829MNC |
5962-8959831MYA |
L7C109YMB25 |
Description |
Standard SRAM, 128KX8, 25ns, CMOS, CQCC32, 0.450 X 0.700 INCH, CERAMIC, LCC-32 |
Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32 |
Standard SRAM, 128KX8, 25ns, CMOS, CQCC32, 0.450 X 0.700 INCH, CERAMIC, LCC-32 |
Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32 |
Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32 |
Parts packaging code |
QFJ |
SOJ |
QFJ |
SOJ |
SOJ |
package instruction |
QCCN, LCC32,.45X.7 |
0.440 INCH, CERAMIC, SOJ-32 |
QCCN, LCC32,.45X.7 |
0.440 INCH, CERAMIC, SOJ-32 |
0.440 INCH, CERAMIC, SOJ-32 |
Contacts |
32 |
32 |
32 |
32 |
32 |
Reach Compliance Code |
unknown |
compliant |
unknown |
unknown |
unknown |
ECCN code |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
Maximum access time |
25 ns |
25 ns |
25 ns |
25 ns |
25 ns |
Other features |
AUTOMATIC POWER-DOWN |
AUTOMATIC POWER-DOWN |
AUTOMATIC POWER-DOWN |
AUTOMATIC POWER-DOWN |
AUTOMATIC POWER-DOWN |
JESD-30 code |
R-CQCC-N32 |
R-CDSO-J32 |
R-CQCC-N32 |
R-CDSO-J32 |
R-CDSO-J32 |
length |
17.78 mm |
20.9804 mm |
17.78 mm |
20.9804 mm |
20.9804 mm |
memory density |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
STANDARD SRAM |
memory width |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
32 |
32 |
32 |
32 |
32 |
word count |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
character code |
128000 |
128000 |
128000 |
128000 |
128000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
organize |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Exportable |
YES |
NO |
NO |
YES |
YES |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
QCCN |
SOJ |
QCCN |
SOJ |
SOJ |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER |
SMALL OUTLINE |
CHIP CARRIER |
SMALL OUTLINE |
SMALL OUTLINE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Filter level |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
38535Q/M;38534H;883B |
Maximum seat height |
2.54 mm |
4.191 mm |
2.54 mm |
4.191 mm |
4.191 mm |
Minimum standby current |
2 V |
2 V |
2 V |
2 V |
2 V |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
Terminal form |
NO LEAD |
J BEND |
NO LEAD |
J BEND |
J BEND |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
QUAD |
DUAL |
QUAD |
DUAL |
DUAL |
width |
11.43 mm |
10.9093 mm |
11.43 mm |
10.9093 mm |
10.9093 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
Is it lead-free? |
Contains lead |
Contains lead |
- |
- |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
- |
incompatible |
Maker |
LOGIC Devices |
- |
- |
LOGIC Devices |
LOGIC Devices |
I/O type |
COMMON |
COMMON |
COMMON |
- |
COMMON |
JESD-609 code |
e0 |
- |
e4 |
e0 |
e0 |
Humidity sensitivity level |
3 |
1 |
3 |
- |
3 |
Encapsulate equivalent code |
LCC32,.45X.7 |
SOJ32,.44 |
LCC32,.45X.7 |
- |
SOJ32,.44 |
Peak Reflow Temperature (Celsius) |
225 |
225 |
- |
- |
225 |
power supply |
5 V |
5 V |
5 V |
- |
5 V |
Maximum standby current |
0.01 A |
0.001 A |
0.01 A |
- |
0.001 A |
Maximum slew rate |
0.14 mA |
0.145 mA |
0.14 mA |
- |
0.145 mA |
Terminal surface |
Tin/Lead (Sn/Pb) - hot dipped |
- |
Gold (Au) |
TIN LEAD |
Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
NOT SPECIFIED |