5962-8959829MYC datasheet, PDF

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5962-8959829MYC: DescriptionStandard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32; Categorystorage storage; File Size684KB，9 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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5962-8959829MYC Overview

Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32

5962-8959829MYC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	SOJ
package instruction	0.440 INCH, CERAMIC, SOJ-32
Contacts	32
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-CDSO-J32
length	20.9804 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of ports	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SOJ
Encapsulate equivalent code	SOJ32,.44
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	4.191 mm
Maximum standby current	0.001 A
Minimum standby current	2 V
Maximum slew rate	0.145 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.9093 mm
Base Number Matches	1

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	5962-8959829MYC	5962-8959837MNA	5962-8959829MNC	5962-8959831MYA	L7C109YMB25
Description	Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32	Standard SRAM, 128KX8, 25ns, CMOS, CQCC32, 0.450 X 0.700 INCH, CERAMIC, LCC-32	Standard SRAM, 128KX8, 25ns, CMOS, CQCC32, 0.450 X 0.700 INCH, CERAMIC, LCC-32	Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32	Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32
Parts packaging code	SOJ	QFJ	QFJ	SOJ	SOJ
package instruction	0.440 INCH, CERAMIC, SOJ-32	QCCN, LCC32,.45X.7	QCCN, LCC32,.45X.7	0.440 INCH, CERAMIC, SOJ-32	0.440 INCH, CERAMIC, SOJ-32
Contacts	32	32	32	32	32
Reach Compliance Code	compliant	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	25 ns	25 ns	25 ns	25 ns	25 ns
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
JESD-30 code	R-CDSO-J32	R-CQCC-N32	R-CQCC-N32	R-CDSO-J32	R-CDSO-J32
length	20.9804 mm	17.78 mm	17.78 mm	20.9804 mm	20.9804 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of ports	1	1	1	1	1
Number of terminals	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	YES	NO	YES	YES
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	SOJ	QCCN	QCCN	SOJ	SOJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	CHIP CARRIER	CHIP CARRIER	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	38535Q/M;38534H;883B
Maximum seat height	4.191 mm	2.54 mm	2.54 mm	4.191 mm	4.191 mm
Minimum standby current	2 V	2 V	2 V	2 V	2 V
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	J BEND	NO LEAD	NO LEAD	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL
width	10.9093 mm	11.43 mm	11.43 mm	10.9093 mm	10.9093 mm
Base Number Matches	1	1	1	1	1
Is it lead-free?	Contains lead	Contains lead	-	-	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	-	incompatible
I/O type	COMMON	COMMON	COMMON	-	COMMON
Humidity sensitivity level	1	3	3	-	3
Encapsulate equivalent code	SOJ32,.44	LCC32,.45X.7	LCC32,.45X.7	-	SOJ32,.44
Peak Reflow Temperature (Celsius)	225	225	-	-	225
power supply	5 V	5 V	5 V	-	5 V
Maximum standby current	0.001 A	0.01 A	0.01 A	-	0.001 A
Maximum slew rate	0.145 mA	0.14 mA	0.14 mA	-	0.145 mA
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED
Maker	-	LOGIC Devices	-	LOGIC Devices	LOGIC Devices
JESD-609 code	-	e0	e4	e0	e0
Terminal surface	-	Tin/Lead (Sn/Pb) - hot dipped	Gold (Au)	TIN LEAD	Tin/Lead (Sn/Pb)

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