MC14504BALDS datasheet, PDF - EEWORLD Datasheet

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MC14504BALDS: DescriptionIC,TTL-TO-CMOS TRANSLATOR,CMOS,DIP,16PIN,CERAMIC; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size627KB，9 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14504BALDS Overview

IC,TTL-TO-CMOS TRANSLATOR,CMOS,DIP,16PIN,CERAMIC

MC14504BALDS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Interface integrated circuit type	TTL/CMOS TO CMOS TRANSLATOR
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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MC14504BALDS Related Products

	MC14504BALDS	MC14504BCPDS	MC14504BCPD	MC14504BCLD	MC14504BCLS	MC14504BDEBS
Description	IC,TTL-TO-CMOS TRANSLATOR,CMOS,DIP,16PIN,CERAMIC	IC,TTL-TO-CMOS TRANSLATOR,CMOS,DIP,16PIN,PLASTIC	IC,TTL-TO-CMOS TRANSLATOR,CMOS,DIP,16PIN,PLASTIC	IC,TTL-TO-CMOS TRANSLATOR,CMOS,DIP,16PIN,CERAMIC	IC,TTL-TO-CMOS TRANSLATOR,CMOS,DIP,16PIN,CERAMIC	IC,TTL-TO-CMOS TRANSLATOR,CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Interface integrated circuit type	TTL/CMOS TO CMOS TRANSLATOR	TTL/CMOS TO CMOS TRANSLATOR	TTL/CMOS TO CMOS TRANSLATOR	TTL/CMOS TO CMOS TRANSLATOR	TTL/CMOS TO CMOS TRANSLATOR	TTL/CMOS TO CMOS TRANSLATOR
JESD-30 code	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	-	-

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