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TSV324AIYPT

Description
Headers u0026 Wire Housings 2.0 W/B Conn 9Ckt EmbsTp Pkg
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size455KB,21 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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TSV324AIYPT Overview

Headers u0026 Wire Housings 2.0 W/B Conn 9Ckt EmbsTp Pkg

TSV324AIYPT Parametric

Parameter NameAttribute value
Brand NameSTMicroelectronics
MakerSTMicroelectronics
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP14,.25
Contacts14
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time20 weeks
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum average bias current (IIB)0.15 µA
Maximum bias current (IIB) at 25C0.125 µA
Minimum Common Mode Rejection Ratio60 dB
Nominal Common Mode Rejection Ratio80 dB
frequency compensationYES
Maximum input offset current (IIO)0.06 µA
Maximum input offset voltage1000 µV
JESD-30 codeR-PDSO-G14
JESD-609 codee3/e4
length5 mm
low-biasNO
low-dissonanceNO
micropowerYES
Humidity sensitivity level1
Nominal Negative Supply Voltage (Vsup)
Number of functions4
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
powerNO
power supply3/5 V
Programmable powerNO
Certification statusNot Qualified
Maximum seat height1.2 mm
minimum slew rate0.42 V/us
Nominal slew rate0.6 V/us
Maximum slew rate3.5 mA
Supply voltage upper limit7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyBICMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMATTE TIN/NICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
Nominal Uniform Gain Bandwidth1300 kHz
Minimum voltage gain5011
broadbandNO
width4.4 mm

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Brand Name STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code TSSOP TSSOP SOIC SOIC SOIC SOIC
package instruction TSSOP, TSSOP14,.25 TSSOP, TSSOP14,.25 SOP, SOP8,.25 LEAD FREE, SOP-8 SOP, SOP14,.25 SOP, SOP14,.25
Contacts 14 14 8 8 14 14
Reach Compliance Code compliant compliant compliant compliant unknown compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Maximum average bias current (IIB) 0.15 µA 0.15 µA 0.15 µA 0.15 µA 0.15 µA 0.15 µA
Maximum bias current (IIB) at 25C 0.125 µA 0.125 µA 0.13 µA 0.13 µA 0.13 µA 0.125 µA
Nominal Common Mode Rejection Ratio 80 dB 80 dB 80 dB 80 dB 80 dB 80 dB
frequency compensation YES YES YES YES YES YES
Maximum input offset voltage 1000 µV 3000 µV 3000 µV 1000 µV 3000 µV 3000 µV
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G8 R-PDSO-G8 R-PDSO-G14 R-PDSO-G14
JESD-609 code e3/e4 e4 e4 e4 e4 e4
length 5 mm 5 mm 4.9 mm 4.9 mm 8.65 mm 8.65 mm
low-bias NO NO NO NO NO NO
low-dissonance NO NO NO NO NO NO
micropower YES YES YES YES YES YES
Humidity sensitivity level 1 3 1 1 1 1
Number of functions 4 4 1 2 4 4
Number of terminals 14 14 8 8 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP SOP SOP SOP SOP
Encapsulate equivalent code TSSOP14,.25 TSSOP14,.25 SOP8,.25 SOP8,.25 SOP14,.25 SOP14,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
method of packing TAPE AND REEL TAPE AND REEL TUBE TUBE TUBE TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power NO NO NO NO NO NO
power supply 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V
Programmable power NO NO NO NO NO NO
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm
Nominal slew rate 0.6 V/us 0.6 V/us 0.6 V/us 0.6 V/us 0.6 V/us 0.6 V/us
Maximum slew rate 3.5 mA 3.5 mA 0.835 mA 1.75 mA 3.34 mA 3.5 mA
Supply voltage upper limit 7 V 7 V 7 V 7 V 7 V 7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface MATTE TIN/NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 30 30 30 40
Nominal Uniform Gain Bandwidth 1300 kHz 1300 kHz 1300 kHz 1300 kHz 1300 kHz 1300 kHz
Minimum voltage gain 5011 5011 5000 5000 5000 5011
broadband NO NO NO NO NO NO
width 4.4 mm 4.4 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm
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