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SK Hynix announced that it has successfully developed the industry's first HBM3 DRAM with the best specifications available. HBM3 is the fourth-generation HBM (High Bandwidth Memory) technology*, wh...[Details]
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On October 17, according to foreign media reports, TSMC, which manufactures chips for Apple, Nvidia, AMD and other manufacturers, released its third-quarter financial report this afternoon. Its rev...[Details]
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Recently, TSMC has announced on its official website that they will establish a joint venture European semiconductor manufacturing company with Bosch, Infineon and NXP Semiconductors in Dresden, Saxo...[Details]
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SK hynix expressed confidence in its high-bandwidth memory (HBM) manufacturing technology. The company stressed that its proprietary HBM is much more powerful than competitors' products, which will...[Details]
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According to a recent research survey by a market research company, the advanced packaging market will rise from its current market value to more than US$25 billion and will exceed US$40 billion by 2...[Details]
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In order to solve the current tight supply of 28nm process wafer foundry capacity, the market has heard that wafer foundry giant UMC is discussing investment capacity cooperation with three major IC ...[Details]
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Recently, French Finance Minister Agnes Runacher and STMicroelectronics CEO Jean-Marc Chéry visited Singapore together to inspect STMicroelectronics' newly established Fab in Singapore. ST officia...[Details]
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According to Taiwan Economic Daily, lithography machine giant ASML will expand investment in Taiwan. ASML's new factory in Taiwan is expected to start construction in July next year. It is the compan...[Details]
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On September 26, according to Taiwan's "United Daily News", as TSMC's supply chain expands CoWoS advanced packaging production capacity, the increase in the price of these interlayer films will event...[Details]
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According to news on October 15, Samsung Electronics, currently the second largest wafer foundry, may not be optimistic about its capacity utilization rate next year. TrendForce predicts that the cap...[Details]
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Shanghai, China – April 14, 2021 – Today, TE Connectivity (hereinafter referred to as “TE”) appeared at the 2021 Munich Shanghai Electronics Show (TE booth: N5-5306) with the theme of “Technology int...[Details]
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On June 17, the 2nd China Nansha International Integrated Circuit Industry Forum (2023 IC NANSHA), hosted by Xinmo Research, opened in Nansha, Guangzhou. "Daily Economic News" reporters learned on th...[Details]
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According to news on October 31, in 2015, Western Digital acquired SanDisk, a well-known flash memory company, for US$19 billion in cash and stock transactions. Today, however, Western Digital announ...[Details]
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According to media reports on December 11, NVIDIA founder and CEO Jensen Huang said during his first visit to Vietnam that the Vietnamese market is a very important market and plans to establish a ch...[Details]
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The company achieved positive gross profit margin in the third quarter, with a single-quarter gross profit margin of approximately 6%.
On October 13, 2024, Xinlian Integrated Circuit...[Details]
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