PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
[Project Overview] This project uses CY8CKIT-149 PSoC 4100S as the control core, uses an external LCD1602 as a display device, and uses external buttons and LEDs as signal receiving and display tests....
Hello everyone, I am making a geomagnetic module now. The schematic diagram is based on the data sheet and the ready-made module. After welding, the configuration register is read and written successf...
The CH582 interrupt also has an interrupt controller, abbreviated as PFIC. It should be similar to the NVIC in ARM, managing the priority and enable of interrupts.
This time, only the most basic exter...
1.＃i nclude means to go to the editor setting directory, ＃i nclude "" means to go to the current project directory.
2. To call a function in another file, put the function file in the current project ...
This article clearly points out the issues related to humidity in printed circuit boards. This is a precise article about reducing the effects of moisture on any type of printed circuit board. From ma...
[i=s]This post was last edited by qwqwqw2088 on 2019-1-7 08:56[/i] [size=4] Among commonly used electronic components, capacitors are the most complex in terms of types and specifications. In particul...
The world's first 3D packaged chip is born! On Thursday, UK-based AI chip company Graphcore released an IPU product, Bow, which uses TSMC's 7nm 3D packaging technology. It is reported that this p...[Details]
On June 5, NXP Semiconductors announced plans to establish a joint venture, VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), with the world's leading semiconductor company.
The ...[Details]
In the era of entrepreneurship, there is never a shortage of "Silicon Valley-style" myths. Over the past twenty years, we have witnessed the overnight rise of BAT, are familiar with the progress an...[Details]
Recently, at the 2021 Renesas Investor Summit, Shinichi Yoshioka, the company's senior vice president and CTO, gave a keynote speech entitled "Passion for Innovation and R&D, Renesas Core Technology ...[Details]
According to news on July 19, ASML announced today that it has raised its fiscal year guidance and expects net sales growth to reach 30%, mainly due to full orders for lithography machines. ASML's se...[Details]
Researchers from the University of Southampton in the UK published a paper in the latest issue of Nature Physics, stating that classical metamaterial nanostructures can be driven into a state that ...[Details]
Officials from multiple departments of the U.S. government are planning to impose new restrictions on Huawei, requiring foreign companies that use U.S. chip manufacturing equipment to obtain a U....[Details]
Agreement with JASM ensures ADI's long-term chip supply and focuses on 40nm and more advanced process nodes Beijing, China, February 23, 2024 - Analog Devices, Inc. announced that it has reached an...[Details]
Samsung Electronics reportedly announced today that it will merge its mobile and consumer electronics divisions to focus on developing its logic chip business. The massive move is the latest sign o...[Details]
News at noon on April 25, the 4th Digital China Construction Summit opened today. During the summit, ZTE announced the company's latest global patent count, 5G essential standards, technology value a...[Details]
In March when the epidemic was effectively controlled, various places ushered in a round of concentrated construction and signing waves. Many major projects, including the Fuxin Semiconductor ana...[Details]
On April 19, SK Hynix announced that it had signed a memorandum of understanding (MOU) with TSMC to advance the development of HBM4 and next-generation packaging technology, with the goal of puttin...[Details]
Wang Jiangping, member of the Party Leadership Group and Vice Minister of the Ministry of Industry and Information Technology, hosted a symposium on the operation of industrial economy in the first h...[Details]
On May 7, the US government approved a CHIPS Act funding application of US$285 million (currently approximately RMB 2.055 billion) to a research institute to develop digital twins for the chip manu...[Details]
According to the final statistics of Gartner, global semiconductor revenue in 2021 increased by 26.3% year-on-year, totaling US$595 billion. "The various events that caused the current chip shorta...[Details]
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