MMDT5401 datasheet, PDF - EEWORLD Datasheet

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MMDT5401: DescriptionRated power: 200mW Collector current Ic: 200mA Collector-emitter breakdown voltage Vce: 150V Transistor type: 2 PNP (dual) Double PNP, Vceo=-150V, Ic=-0.2A; CategoryDiscrete semiconductor The transistor; File Size2MB，4 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Environmental Compliance; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

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MMDT5401 Overview

Rated power: 200mW Collector current Ic: 200mA Collector-emitter breakdown voltage Vce: 150V Transistor type: 2 PNP (dual) Double PNP, Vceo=-150V, Ic=-0.2A

MMDT5401 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	JCET
package instruction	,
Reach Compliance Code	unknown
Maximum collector current (IC)	0.2 A
Minimum DC current gain (hFE)	100
Maximum operating temperature	150 °C
Polarity/channel type	PNP
Maximum power dissipation(Abs)	0.2 W
surface mount	YES
Nominal transition frequency (fT)	100 MHz

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JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-363 Plastic-Encapsulate Transistors

MMDT5401

FEATURES

Epitaxial Planar Die Construction

Complementary NPN Type Available(MMDT 5551)

Ideal for Medium Power Amplification and Switching

DUAL TRANSISTOR (PNP+PNP)

SOT-363

MRKING:K4M

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

stg

Parameter

Collector- Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector Power Dissipation

Junction Temperature

Storage Temperature

Value

-160

-150

-5

-0.2

0.2

150

-55-150

Units

℃

ELECTRICAL CHARACTERISTICS (Ta= 25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

FE(1)

FE(2)

FE(3)

Collector-emitter saturation voltage

CE(sat)1

CE(sat)2

BE(sat)1

BE(sat)2

Test conditions

=-100μA ,

= -1mA ,

=-10μA,

Min

-160

-150

-5

-0.05

100

-0.2

-0.5

-1

100

8.0

MHz

300

Typ

Max

Unit

μA

=-120 V , I

=-3V ,

=-5 V,

= -1mA

= -10mA

= -50mA

=-10 mA, I

=-1mA

=-50 mA, I

=-5mA

= -10 mA, I

=-1mA

= -50 mA, I

=-5mA

= -10V, I

= -10mA,f = 100MHz

=-10V, I

= 0,f=1MHz

= -5.0V, I

= -200μA,

= 10Ω,f = 1.0kHz

Base-emitter saturation voltage

Transition frequency

Output Capacitance

Noise Figure

www.cj-elec.com

C,Jul,2015

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