PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
This application tests cables other than the nominal 50Ω, including coaxial, twisted pair, and differential high-speed data lines, including impedance parameters, S parameters (insertion loss, standin...
I use a network port in my project. Now the network port can be connected and I am testing it. The program is written like this: The MCU sends data to the host computer about once a second. Use the ne...
With the increasing number of automotive electronic devices, it is a reliable and economical approach to use serial bus to achieve multi-channel transmission and form an automotive electronic network....
Article Directory1External storage device (U disk, TF card) use2Network configuration3Touch test4Screen brightness (backlight)All the test programs in this section require the development board to hav...
For the single-chip microcomputer system, interruption is a very important feature and is worth studying.
Definition of an interrupt: When the need arises, the CPU temporarily stops the execution of t...
The launchpad of MSP430F5529 is a development kit that TI gives away more frequently. At least everyone in our lab has one. Many people think it is slow. Indeed, compared with the speed of STM32F103 (...
IC Nansha Special Report: AMD Senior Vice President and Greater China President Pan Xiaoming: Process, architecture, and platform optimization break through computing boundaries On June 25, the Chi...[Details]
The U.S. Department of Commerce announced today that it plans to provide $1.5 billion in direct financial support to GlobalFoundries (NASDAQ: GFS) (GF) as part of the U.S. Chips and Science Act. This...[Details]
Intel recently changed its leadership. Its veteran engineer Pat Gelsinger will replace Bob Swan as trusted CEO. The newcomer is seen as a lifeline, connected to past glory, and a potential savior of ...[Details]
Gartner: Global semiconductor revenue will decrease by 11% in 2023 Memory revenue sees one of its biggest declines ever Intel takes back first place from Samsung NVIDIA ranks among the top...[Details]
Notable suppliers include Alps Alpine, Ambiq Micro, Amphenol LTW, HELUKABEL and Zettler Magnetics DigiKey, the world's leading commercial distributor of off-the-shelf technology components and a...[Details]
Western Digital is currently negotiating to merge its NAND flash memory production business and is about to finalize the final plan. They will create the world's largest NAND flash memory manufacture...[Details]
“The biggest disadvantage that the United States has in this tech race is its unwillingness to spend money,” James Andrew Lewis, senior vice president and director of the technology policy program at...[Details]
News on the morning of December 31st, Huawei's rotating chairman Guo Ping delivered a New Year's speech today. He said that the annual sales revenue in 2021 is expected to be approximately 634 billio...[Details]
According to the latest report on the official website of Okinawa Institute of Science and Technology Graduate University (OIST), the university has designed an extreme ultraviolet (EUV) lithograph...[Details]
Texas Instruments (TI) (Nasdaq: TXN) recently announced its second quarter financial results, with revenue of $3.82 billion, net income of $1.13 billion, and earnings per share of $1.22.
...[Details]
Intel CEO Pat Gelsinger recently said that in the AI era, Intel processors will not lose power but will continue to play an important role. Moore's Law is still valid.
Gelsinger directly att...[Details]
The Bell test confirms whether two systems are actually entangled. Scientists from the Swiss Federal Institute of Technology in Zurich (ETH) published a paper in the latest issue of Nature magazine s...[Details]
Exploring Power Efficiency and Robustness in Electronic Design
November 13, 2024 –
Mouser Electronics, a leading New Product Introduction (NPI) distributor™ focused on driving in...[Details]
Schematic of stacked, twisted cuprate superconductors. Image source: Physicist Organization Network Superconductors have been a hot topic in physics for decades. But these materials, which allow pe...[Details]
In September of this year, Intel announced the first glass substrate for next-generation advanced packaging, and plans to provide complete solutions to the market in the next few years, allowing the ...[Details]
Test/Measurement
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