GMZ7.5B_R2_10001

Nexperia BV achieves a solid foundation with Morningstar Sustainalytics' ESG Risk Rating of 18.7 Nijmegen, September 19, 2023 – Nexperia, the high-volume production specialist in basic semiconduct...[Details]

Despite the impact of adverse factors such as the macroeconomic downturn and tariff policies, sales in the fourth quarter still reached US$4.7 billion, in line with expectations Fiscal 2019 sales i...[Details]

Heterogeneous integration drives changes in panel process equipment (drivers). Heterogeneous integration (HI) has become the latest turning point in packaging technology. Demand for system-in...[Details]

The chip shortage has severely affected industries ranging from automobiles to consumer electronics. However, the CEO of GlobalFoundries, a US chip foundry spun off from AMD, recently said that the i...[Details]

According to news on April 26, on the evening of April 25, a fire broke out at the TSMC Advanced Packaging and Testing Factory No. 6 under construction in Zhunan Science Park, Miaoli County. Thick sm...[Details]

Han's Laser Technology Industry Group Co., Ltd. (hereinafter referred to as Han's Laser) and Suzhou Xiangcheng Economic and Technological Development Zone held a signing ceremony for the "Han's Laser...[Details]

According to UDN reports, Intel has completed the development of the Intel 18A (1.8nm level) and Intel 20A (2nm level) process processes required for chip manufacturing for its own products and Inte...[Details]

Recently, Sri Samavedam, head of Imec's CMOS field, published five major trends in the semiconductor industry: Trend 1: Moore’s Law will continue for the next 8 to 10 years Over the next eight to...[Details]

According to semiwiki, the design and migration of analog cells is completely different from digital cells because the inputs and outputs of analog cells typically have continuously variable voltage ...[Details]

Tektronix's cloud classroom for semiconductor materials and device science is about to start. This knowledge feast dedicated to semiconductor materials is divided into two seasons. The first season f...[Details]

MagnaChip recently announced that it can provide 0.13 micron BCD process for automotive-grade power products. BCD (Bipolar-CMOS-DMOS) is a combination of three different process technologies on one ...[Details]

Compiled from EETIMES Applied Materials and IME have signed a five-year collaboration agreement focused on heterogeneous chip integration research. The collaboration will continue to conduct R&D pr...[Details]

Beijing time, August 9th morning news, according to a document released on Monday, Qualcomm agreed to purchase an additional $4.2 billion worth of semiconductor chips from semiconductor wafer foundry...[Details]

  China's chip demand is extremely strong, but China's chip technology has not yet entered the world's first echelon. 95% of high-end special chips, more than 70% of smart terminal chips and the vas...[Details]

The CEOs of Intel and Micron will attend a hearing of the U.S. Senate Commerce Committee on Wednesday (23rd) to promote legislation to boost the U.S. semiconductor industry. 　　 In February of this ye...[Details]