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GLZ39B_R1_10001

Description
Accuracy: - Voltage regulation value (typical value): 35.36V (Min) ~ 37.19V (Max) Reverse leakage current: 200nA @ 30V Maximum power: 500mW
CategoryDiscrete semiconductor    diode   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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GLZ39B_R1_10001 Overview

Accuracy: - Voltage regulation value (typical value): 35.36V (Min) ~ 37.19V (Max) Reverse leakage current: 200nA @ 30V Maximum power: 500mW

GLZ39B_R1_10001 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPANJIT
package instructionO-LELF-R2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance85 Ω
Maximum forward voltage (VF)1 V
JESD-30 codeO-LELF-R2
Maximum knee impedance250 Ω
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-55 °C
Package body materialGLASS
Package shapeRECTANGULAR
Package formLONG FORM
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Nominal reference voltage39 V
Maximum reverse current0.2 µA
Reverse test voltage30 V
surface mountYES
technologyZENER
Terminal formWRAP AROUND
Terminal locationEND
Maximum voltage tolerance9.33%
Working test current5 mA
Base Number Matches1

GLZ39B_R1_10001 Preview

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GLZ2.0 SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE
2.0 to 56 Volt
POWER
500 mWatt
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2.0
0.063(1.6)
0.055(1.4)D IA .
0.020(0.5)
0.012(0.3)
0.146(3.7)
0.130(3.3)
0.020(0.5)
0.012(0.3)
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.001 ounces, 0.03 grams.
• Polarity : Color band denotes cathode end
• Packing information
T/R - 2.5K per 7" plastic Reel
T/R - 10K per 13" plastic Reel
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at T
A
= 25
O
C
Junction Temperature Range
Storage Temperature Range
Symbol
Value
500
-55 to + 175
-65 to + 175
Units
mW
O
P
TOT
T
J
T
STG
C
C
O
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
Parameter
Thermal Resistance Junction to Ambient Air
Forward Voltage at I
F
= 100mA
Symbol
Min.
--
--
Typ.
Max.
0.3
1
o
Units
C/mW
V
R
Θ
JA
V
F
--
--
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
October 2,2017-REV.06
PAGE . 1
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