GDZJ6.2C-34_B0_10001

The new method can quickly produce high-quality 2D films. Image source: Physicists Organization website Japanese scientists have developed a new technology that can produce two...[Details]

IMEC held a press conference and its Future Summit to discuss technological developments for future consumer and industrial products. The summit discussed many health-related developments, including ...[Details]

Texas Instruments (TI) has announced plans to begin construction of a new 300mm semiconductor wafer manufacturing facility (or "fab") in Sherman, Texas, next year. With up to four fabs in North Texas...[Details]

On May 8, it was reported that ASML's most advanced EUV lithography machine orders this year have been monopolized by Intel, with the price of a single unit exceeding 2.5 billion yuan. It is r...[Details]

On December 11, TCL Technology issued an announcement stating that the company's wholly-owned Hong Kong subsidiary TCL Technology Investment and TCL Industrial (Hong Kong) signed a "Share Transfer Ag...[Details]

  From September 25 to 26, the 2020 Third Semiconductor Talent Conference and the "China Core" Integrated Circuit Industry-Education Integration Training Base (Nanjing) Establishment Ceremony were s...[Details]

In the official M1 Ultra announcement, Apple introduced how Mac Studio, with the support of a new custom chip, enables 2.5 TB/s interconnection bandwidth between UltraFusion chips and allows two M1 M...[Details]

According to foreign media reports, driven by strong demand for home office and learning equipment, as well as strong demand for chips, the production capacity of wafer foundry TSMC has continued to ...[Details]

The semiconductor boom is down, and the IC design industry cannot escape the impact. Not only is the traditional off-season this quarter likely to be even weaker, industry players admit frankly that ...[Details]

On December 25, at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco in early December this year, IBM researchers demonstrated the first advanced CMOS transistor optimize...[Details]

Sony has reportedly successfully developed a semiconductor laser for large-capacity mechanical hard disks (HDDs). This laser can be installed on the HDD head to significantly increase the ability t...[Details]

This article is translated from IEEE, and the authors are Jack Kavalieros, a researcher and vice president of devices and integration in Intel's component research group, and Marko Radosavljevic, a p...[Details]

According to news on December 27, Canon announced the FPA-1200NZ2C in October this year, which is a nanoimprint lithography (NIL) semiconductor equipment. Canon President Fujio Mitarai recently said ...[Details]

SANTA CLARA, Calif., Nov. 8, 2019 – Applied Materials, Inc. has unveiled the Materials Engineering Technology Accelerator ( META Center), a first-of-its-kind facility designed to help customers accel...[Details]

At the heart of every successful space mission is a complex and powerful computer system. In the 1960s, relatively basic computing systems took humans to the moon. More recently, the Parker Probe ...[Details]