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BZT52-B3T/R13

Description
Zener Diode, 3V V(Z), 2%, 0.41W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance  

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZT52-B3T/R13 Overview

Zener Diode, 3V V(Z), 2%, 0.41W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-2

BZT52-B3T/R13 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionR-PDSO-G2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeR-PDSO-G2
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.41 W
Nominal reference voltage3 V
surface mountYES
technologyZENER
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance2%
Base Number Matches1

BZT52-B3T/R13 Preview

Download Datasheet
BZT52-B2V4 SERIES
SURFACE MOUNT SILICON ZENER DIODES
VOLTAGE
2.4 to 75 V
olts
POWER
410 mWatts
0.154(3.90)
0.141(3.60)
0.110(2.80)
0.098(2.50)
FEATURES
• Planar Die construction
• 410mW Power Dissipation
• Zener Voltages from 2.4~75V
• Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2002/95/EC directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.028(0.70)
0.019(0.50)
0.071(1.80)
0.055(1.40)
MECHANICAL DATA
• Case: SOD-123, Molded Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.0004 ounces, 0.01 grams
• Mounting Position: Any
0.005(0.12)MAX.
0.008(0.20)MAX.
0.053(1.35)
0.037(0.95)
0.016(0.40)MIN.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25 C unless otherwise noted)
o
Parameter
Maximum Power Dissipation (Notes 1)
Forward Voltage Drop at I
F
=10mA
Operating Junction Temperature and StorageTemperature Range
Symbol
Value
410
0.9
-55 to +150
Units
mW
V
O
P
D
V
F
T
J
C
1
2
C a th o d e
A node
NOTES:
1. Mounted on 48cm
2
FR-4 PCB board
October 19,2011-REV.03
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