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Recently, at the Advanced Packaging and Testing Forum held at the same time as ICCAD 2019, Natalian Der, business strategy director of Teradyne Co., Ltd., gave a keynote speech entitled "Testing - Br...[Details]

With the vigorous rise of a new round of industrial revolution and industrial transformation, smart sensors are being widely used in many fields such as industrial Internet, autonomous driving, biom...[Details]

Institutional data shows that driven by the growing demand for application processors and other telecommunications equipment sales in 5G smartphones, the pure wafer foundry market, which experienced ...[Details]

Samsung Electronics continues to cut its memory chip production, including NAND flash memory used in smartphones and PCs, after reporting an operating loss of US$3.4 billion (4.36 trillion won) in it...[Details]

Samsung is the only company that can compete with TSMC in 5nm process foundry, but its actual performance is not satisfactory. Qualcomm's use of Samsung's 5nm Snapdragon 888 has been questioned. The ...[Details]

Chip selection is difficult, and choosing a suitable domestic chip is even harder. "Domestic production rate" is an important indicator to measure products nowadays. As the domestic chip industry ch...[Details]

In the global technology industry, Nan Ya Printed Circuit Board Corp. in Taiwan is not a household name, but this little-known company produces an important component urgently needed in the chip manu...[Details]

There is no doubt that Intel 4004, as the first commercial microprocessor, is an important milestone in the history of technological development, which once again proves that technology changes life....[Details]

Memory giant Micron Technology recently announced the completion of the expansion of its NAND Flash plant, Fab 10A in Singapore. Micron CEO Sanjay Mehrotra said that the new plant will adjust capital...[Details]

On the evening of January 3, Ziguang Co., Ltd. announced that the company will acquire the remaining 49% of New H3C Group Co., Ltd. (hereinafter referred to as "New H3C") through its wholly-owned sub...[Details]

The plan to build the advanced packaging and testing plant in Zhunan, Taiwan Semiconductor Manufacturing Co., Ltd., was approved in principle by the Environmental Impact Assessment Review Meeting tod...[Details]

QFN ( Quad Flat No-leads Package) is one of the surface mount packages. It is worth noting that the QFN package is completely different from the LCC package. The LCC still has an epitaxial ...[Details]

Analog Devices announces €630 million investment in next-generation semiconductor R&D and manufacturing facility in Limerick • New facilities will support cutting-edge applications such as digital...[Details]

The Semiconductor Industry Association (SIA) announced today that global semiconductor industry sales in October 2022 were US$46.9 billion, a slight decrease of 0.3% from US$47 billion in September 2...[Details]

AMD has successively released three products of the Instinct MI200 series of accelerated computing cards: MI250X, MI250, and MI210. The next generation is also on the way. The authoritative whistlebl...[Details]