2SB647B(TO-92MOD) datasheet, PDF

Datasheet> All Categories > Discrete semiconductor> The transistor> 2SB647B(TO-92MOD)

2SB647B(TO-92MOD): DescriptionTransistor; CategoryDiscrete semiconductor The transistor; File Size117KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

2SB647B(TO-92MOD) Overview

Transistor

2SB647B(TO-92MOD) Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknow
Base Number Matches	1

2SB647B(TO-92MOD) Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-92MOD Plastic-Encapsulate Transistors

2SB647/2SB647A

TRANSISTOR (PNP)

TO – 92M

TO – 92MOD

1. COLLECTOR

1. EMITTER

2. BASE

2. COLLECTOR

3. EMITTER

3. BASE

FEATURES

Low Frequency Power Amplifier

Complementary Pair with 2SD667/A

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current

Collector Power Dissipation

Thermal Resistance From Junction To Ambient

Junction Temperature

Storage Temperature

2SB647

2SB647A

EBO

θJA

stg

Value

-120

-80

-100

-5

-1

900

139

150

-55~+150

Unit

℃/W

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

DC current gain

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

FE(1)*

FE(2) *

Collector-emitter saturation voltage

Base-emitter voltage

Collector output capacitance

Transition frequency

CE(sat)

Test

conditions

2SB647

2SB647A

Min

-120

-80

-100

-5

Typ

Max

Unit

= -10µA,I

=-1mA,I

=-10µA,I

=-100V,I

=-5V, I

=-150mA

=-5V, I

=-500mA

=-500mA,I

=-50mA

=-5V, I

=-150mA

=-10V,I

=0, f=1MHz

=-5V,I

=-150mA

2SB647

2SB647A

-10

-1

-1.5

140

320

200

μA

MHz

*Pulse test: pulse width

≤300μs,

duty cycle≤ 2.0%.

CLASSIFICATION OF h

FE(1)

TYPE

2SB647A

RANK

RANGE

60-120

100-200

160-320

2SB647

A,Dec,2010

Recommended Resources

Low distortion oscillator circuit using varactor diode b

RCC partial resonant feedback converter circuit diagram

High current switching power supply starting circuit

Circuit to extend signal light battery life

2.5kHz Wien bridge signal generator circuit

High-performance dual-band wireless microphone receiving circuit

A novice’s question is, how to find the most suitable chip when making hardware?: When doing hardware projects, there may be dozens or even hundreds of chips to choose from to complete a function, but we don’t know in advance which chip is the most suitable in terms of cost and per...; lingking DIY/Open Source Hardware

How to create beam-forming smart antennas using FPGAS: ...; btty038 RF/Wirelessly

The problem that the microcontroller reset circuit cannot burn the program when connected to the battery: Has anyone encountered the problem that the MCU reset circuit cannot burn the program when connected to the battery? When the PCBA is connected to the battery, it cannot be burned. You must disconnect...; QWE4562009 MCU

64 details that must be paid attention to in switching power supply design: 1. The transformer lead numbers on the transformer drawing, PCB and schematic diagram must be consistent. [/b] [/size][/font][/color][/align][align=left][color=rgb(51, 51, 51)][font=-apple-system-font...; okhxyyo Power technology

Domestic voltage regulator device: Can you recommend a domestic voltage regulator? Which are the more well-known manufacturers? It would be best if there is a product manual....; y2018y Domestic Chip Exchange

How does a “temperature gun” measure your temperature?: [i=s]This post was last edited by Rambo on 2020-3-12 11:55[/i]These days, the most powerful people on the street are the security guards in public places and the staff of various residential communiti...; 兰博 RF/Wirelessly

Popular Components