2CW032180YQ-PA datasheet, PDF - EEWORLD Datasheet

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2CW032180YQ-PA: Description2CW032XXXYQ-PX SERIES ZENER DIODE CHIPS FOR GLASS SEAL WITH ASYMMETRY LIMITS; CategoryDiscrete semiconductor diode; File Size103KB，4 Pages; ManufacturerSilan; Websitehttp://www.silanic.com.cn/; Environmental Compliance; Hangzhou Silan Microelectronics Co., Ltd. (SSE stock code: Silan Micro, 600460) is located in Hangzhou High-tech Industrial Development Zone. It is a high-tech enterprise specializing in integrated circuit chip design and semiconductor microelectronics related product production. The company's current main products are integrated circuits and semiconductor products.

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2CW032180YQ-PA Overview

2CW032XXXYQ-PX SERIES ZENER DIODE CHIPS FOR GLASS SEAL WITH ASYMMETRY LIMITS

2CW032180YQ-PA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Silan
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode type	ZENER DIODE
Maximum dynamic impedance	150 Ω
Number of components	1
Maximum operating temperature	175 °C
Nominal reference voltage	18 V
surface mount	YES
Working test current	5 mA
Base Number Matches	1

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2CW032XXXYQ-PX

2CW032XXXYQ-PX SERIES ZENER DIODE CHIPS FOR GLASS SEAL WITH

ASYMMETRY LIMITS

DESCRIPTION

2CW032XXXYQ-PX series are low-power zener diode chips

for glass seal that fabricated in silicon epitaxial planar

technology.

The series is asymmetrical regulator voltage chips, that is

the upper limit and lower limit is asymmetrical, e.g. Vz=3.0V

chips: the upper limit is 3.25V, the lower limit Is 2.95V ,the

specification design is better suitable for user’s using habit

For user convenient choice regulator voltage in narrow limit.

The series divided into 4 types in given regulator voltage

and named PA, PB, PC and PD.

2CW032XXXYQ-PX CHIP TOPOGRAPHY

The chip thickness is 140μm. The top electrode material is

Ag bump, and the backside electrode material is Ag.

Chip size: 0.32 X 0.32 (mm) .

2CW032XXXYQ-PX APPEARANCE

Chip Appearance Diagram

Parameter

Chip Size

Chip Thickness

Bump Size

Bump Height

Scribe Line Width

Symbol

Min.

290

120

196

Type

Max.

310

160

240

Unit

μm

ABSOLUTE MAXIMUM RATINGS

Characteristics

Junction Temperature

Storage Temperature

Symbol

stg

Test conditions

----

Value

175

-50~+175

Unit

°C

HANGZHOU SILAN MICROELECTRONICS CO.,LTD

Http: www.silan.com.cn

REV:1.0

2008.02.28

Page 1 of 4

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