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Artistic rendering of the latest experiment in which erbium atoms were integrated into a silicon chip. Image source: Max Planck Institute for Quantum Optics For the first time, German scientists...[Details]
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On March 28, the Semiconductor Industry Association (SEMI) recently released an industry chain report, stating that chip giants TSMC and Intel are expected to build 2-nanometer wafer fabs before th...[Details]
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September 7, 2023 – MediaTek and TSMC jointly announced today that the development of MediaTek’s first Dimensity flagship chip produced using TSMC’s 3nm process is going very smoothly. It has been su...[Details]
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South Korea's SK Hynix Inc said on Thursday it is working on a supply plan for next year's high-capacity memory (HBM) chips as customers are bringing forward their product plans to ride on the arti...[Details]
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On the afternoon of April 11, 2021, the "AI Excitement·Hardware Leap 2021 Tablet Industry Empowering Education Innovation Summit" co-organized by Core Intelligence and Core Bake was successfully ...[Details]
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Saudi Basic Industries Corporation (SABIC) released its first quarter 2023 financial report today. SABIC's sales in the first quarter were 39.69 billion Saudi riyals ($10.58 billion). The company's n...[Details]
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According to foreign media reports, as chip foundry TSMC increases its foundry fees, the price increase of chips and chip-driven electronic devices may continue until 2022. Since the second half of...[Details]
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TSMC's 12-inch wafer fab Fab 21 in Arizona, USA, is being built as expected and will hold the first tool-in ceremony in December. TSMC will invite customers, suppliers, and academia Celebrated with g...[Details]
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Molex, a leading global manufacturer of electronic solutions, has been announced as a winner of Cisco’s 2019 Technology Enablement Excellence Award. Cisco announced the winners at its 28th annual Sup...[Details]
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According to news on October 19, Samsung is the world's largest NAND flash memory supplier and has ambitious plans for the development of V-NAND (what Samsung calls 3D NAND). Samsung shared some rele...[Details]
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Since the chiplet technology was widely publicized by Intel and AMD and successfully introduced, the technology has been constantly hyped and well-known in the past two years. During ICCAD 2019, Dai ...[Details]
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MEMS technology is one of the most widely used technologies at present. I believe everyone knows about MEMS. In order to enhance everyone's understanding of MEMS, this article will introduce MEMS bas...[Details]
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October 9, 2023 Cambridge, UK - Cambridge GaN Devices (CGD) is a fabless environmental technology semiconductor company that has developed a series of energy-efficient GaN power devices and is comm...[Details]
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Reuters reported on January 24 that Toshiba issued a statement on Monday that Toshiba's chip research and development and manufacturing base in Kyushu, southern Japan, has suspended operations after ...[Details]
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Future Electronics, a leading global distributor of electronic components, recently announced that it has signed an expanded distribution agreement with Renesas Electronics, a leading global semicond...[Details]