Introduction to materials used in FPC

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1. Raw materials (1) Glue materials and non-glue materials; the copper on the materials is divided into electrolytic copper and rolled copper. The non-glue rolled copper materials are more flexible and foldable. (2) Material thickness: PI + copper thickness 2. Covering film The covering film is composed of PI and glue. 3. Reinforcement There are generally the following types of reinforcement: PI reinforcement, PED reinforcement, FR4 reinforcement, steel sheet reinforcement, etc. The general reinforcement thickness is PI1/2 1/2, PI11, PI21, PI31 to PI91. The two numbers after PI represent the thickness of PI and the thickness of glue respectively, in Mil. The thickness depends on customer requirements. 4. Pure glue Pure glue is mainly used for lamination and layering of multi-layer boards, and is also used for bonding reinforcement. 5. Shielding film mainly plays the role of signal shielding, and must be grounded. 6. 3M glue is used for bonding reinforcement and fixing FPC.