Comparison of the characteristics of gold wire and gold ribbon bonding interconnects in multi-chip modules

btty038

Comparison of the characteristics of gold wire and gold ribbon bonding interconnects in multi-chip modules [Copy link]

This paper uses the three-dimensional electromagnetic field analysis software HFSS to model and analyze
the microwave characteristics of gold wire and gold ribbon bonding interconnection in millimeter wave multi-chip components , and the gold wire and gold ribbon bonding interconnection is equivalent to a low-pass filter network model consisting of a series resistor, a series inductor and two parallel capacitors . By making test samples, the performance S parameters of single, two, and three connecting wires and gold ribbon connections in the frequency range of 20 to 40GHz were tested using a vector network analyzer and a universal test frame . The test results of the test samples were analyzed and compared with the simulation optimization results, and the two were in good agreement.

多芯片组件中金丝金带键合互连的特性比较_邹军.pdf (1.22 MB, downloads: 8)

2024-1-18 21:59 上传

点击文件名下载附件

吾妻思萌

hfss My classmates call him Head & Shoulders

btty038

A lot of things have been integrated and now they are integrated again...