SMT patch processing_Brief description of the advantages and disadvantages of BGA packaging

四川英特丽

SMT patch processing_Brief description of the advantages and disadvantages of BGA packaging [Copy link]

SMT patch processing_Brief introduction to the advantages and disadvantages of BGA packaging.
There are many different component packaging styles in the production process of SMT patch processing, such as BGA, SOP, QFN, PLCC, SSOP, QFP, etc. The following Guangzhou PCBA processing factory Pet Electronics briefly introduces the advantages and disadvantages of some common BGA packages.

1. Advantages
1. BGA has a small size and large memory capacity. With the same memory and capacity, the volume of BGA packaged IC is only about one-third of that of SOP package.
2. Compared with dense-foot chips such as QFP and SOP, the solder balls of BGA are at the bottom of the package. Compared with dense-foot chips, the ball spacing is larger, and there will be no pin deformation and bending.
3. In terms of electrical performance, BGA package performs better. The main reason is that the pins of BGA are shorter, and the signal path also becomes shorter, which reduces the lead inductance and capacitance and enhances the electrical performance.
4. Good heat dissipation, the spherical contact array forms a gap with the contact surface of the substrate, which is conducive to heat dissipation.
5. In SMT patch processing, BGA and PCB board have good coplanarity, which can ensure the welding quality.
2. Disadvantages
1. Quality inspection BGA packaged IC is more difficult, and X-Ray needs to be used for inspection to ensure the welding quality, which cannot be judged by naked eyes and AOI inspection.
2. BGA pins are at the bottom of components, which is easy to cause welding shadow effect, so the temperature curve setting of reflow soldering in SMT patch processing should be appropriate.
3. In terms of maintenance, BGA components are more complicated than dense-pin chips. The BGA components need to be removed entirely and re-balled before secondary soldering.