I gained a lot from this chapter and I understood what chip manufacturing is all about.
The chip manufacturing process is as follows:
1. Manufacturing silicon wafers is like the bottom layer of a circuit board, or the foundation. All units are on this layer, and this layer is always a piece of stone.
2. Thin film deposition: This layer is the useful layer. The deposited materials are semiconductors, conductors, and insulators. This layer is like the copper layer of a circuit board.
3. Photolithography. The essence of photolithography is to carve out circuit paths.
4. Etching is to dig trenches. There are two types of etching: temperature etching and dry etching.
5. Measurement and inspection, just like checking whether the circuit board has adhesion.
6. Ion implantation to form a PN junction.
7. Interconnection: connecting each independent unit through some process.
8. Post-processing and test packaging
From the above process, I suddenly realized that this was just making a miniature circuit board. I suddenly felt that the chip was not far away from me.
It seems I still need to draw the circuit board well. It turns out that the world is interconnected, and we can draw inferences from one example.
I think the photolithography machine has little to do with me, just like the circuit board is handed over to the circuit board manufacturer. You make it and I pay for it.
And in Section 4.3, I was really struck by what they said. I thought 5nm and 3nm refer to trench length or gate width. The book said they are just equivalent process nodes. This is a bit hard for me to understand.
The sentence that impressed me the most in this chapter is "The reason why a genius is called a genius is perhaps because he can always use the simplest method to solve the most difficult problems."
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