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Recruiting chip design director/engineer/intern positions

1. Responsible for the design of radio frequency, microwave and millimeter wave integrated circuit chips;

2. Design and simulate III-V process MMIC or silicon-based process mm/RFIC chips;

3. Majors in microelectronics, electronic engineering, semiconductor and microwave;

4. Candidates with experience in compound (GaAs/SiGe) CMOS high-performance LNA/PA design are preferred;

5. Familiar with the use of integrated circuit design tools, such as cadence, ADS and various microwave measuring instruments;

Email: ay520wkl@163.com

Address: Chaoyang District, Beijing

This post is from Talking about work
 
 

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