Domestic core TLSR8285 / TLSR8278 multi-protocol wireless chip

damiaa

Domestic core TLSR8285 / TLSR8278 multi-protocol wireless chip [Copy link]

 

Domestic core TLSR8285 / TLSR8278 multi-protocol wireless chip

It's a Shanghai company, and it uses English language.

Telink’s new generation TLSR825x series presents state of the art ultra low power (ULP) concurrent multi-protocol IoT solution at ISM 2.4GHz band. It supports BLE 5.0 with 2X data rate, 4X long range (LR), 8X advertising packet extension (AE), up to 8 antennas for Indoor Positioning, both Telink proprietary and SIG BLE Mesh, Zigbee, RF4CE, HomeKit, Thread, ANT and 2.4GHz proprietary.

The TLSR825x is built around a 32-bit MCU running up to 48MHz. It has 14bit ADC with PGA, AMIC, DMIC, stereo audio output, 6-channel PWM, one quadrature decoder (QDEC), and flexible GPIO interfaces.

The TLSR825x provides excellent RF features includes: -96dBm@ble 1Mbps, -99.5dBm@802.15.4 250kbps, maximum Tx output power is +10dBm. It is embedded with LDO and DCDC, the power supply is 1.8 ~ 3.6V, and provides low power consumption: 5.3mA@Rx fullchip, 4.8mA@Tx 0dBm fullchip, <1uA@Sleep+SRAM, 0.4uA@Sleep.

This makes the TLSR825x an ideal single-chip solution for IoT (Internet of Things) and HID (Human Interface Devices) application such as wearable devices, smart lighting, smart home devices, advanced remote controls, and wireless toys.

Telink’s new generation TLSR827x series presents state of the art ultra low power (ULP) concurrent multi-protocol IoT solution at ISM 2.4GHz band. It has protocol full support for BLE 5.1. It also supports both Telink proprietary and SIG BLE Mesh, Zigbee, RF4CE, HomeKit, Thread, ANT and 2.4GHz proprietary.

The TLSR827x is built around a 32-bit MCU running up to 48MHz. It has 14bit ADC with PGA, AMIC, DMIC, stereo audio output, 6-channel PWM, one quadrature decoder (QDEC), and flexible GPIO interfaces.

Compared with TLSR825x, the TLSR827x series has a few salient features: Allows flexible antenna element switch to fully support BLE 5.1, RF Inductor integrated enabling BOM Reduction, Audio Enhancement, WiFi PTA hardware interface.

The chip is out. The libraries and tools seem to be out.

DS_TLSR8258-E_Datasheet for Telink BLE IEEE802.15.4 Multi-Standard Wireless SoC .pdf (5.38 MB, downloads: 54)

2020-9-8 10:39 上传

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DS_TLSR8278-E_Datasheet for Telink BLE IEEE 802.15.4 Multi-Standard Wireless S.pdf (4.63 MB, downloads: 42)

2020-9-8 10:39 上传

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AN_19052900-E_Telink Zigbee SDK Developer Manual.pdf (1.94 MB, downloads: 31)

2020-9-8 10:39 上传

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Has its own custom IDE and download debugger.

It looks very complete. Not afraid of sanctions. 25 30 want...

是最帅的啊

I also hate this. It's enough that domestic chips have to provide full English documentation.

damiaa

It's the most handsome. Published on 2020-9-8 13:58 I also hate this. Domestic chips give me a full English document. That's enough.

I know that Chinese people have a high level of English proficiency. My English score in the college entrance examination was 150.

freebsder

Maybe they bought someone else's solution and replaced the document directly according to the template. It also needs to be translated into Chinese, which is not as practical as Yatli. Only those with Chinese manuals are domestically produced.