The OP
Published on 2020-4-1 15:55
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This post is from Analog electronics
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Detection of cracks and foreign matter inside metal materials and parts, plastic materials and parts, electronic components, electronic assemblies, LED components, etc.; analysis of internal displacement of BGA and circuit boards; identification of BGA welding defects such as empty solder joints and cold solder joints; analysis of internal conditions of microelectronic systems and sealed components, cables, fixtures, and plastic parts.
However, this thing still has certain harm to the human body.
Details
Published on 2020-4-1 23:11
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Published on 2020-4-1 23:11
Only look at the author
This post is from Analog electronics
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This post is from Analog electronics
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