Forum»Forum › MEMS sensors › [Ready to use] LIS2DTW12 functional demonstration pr ...

2087 views|0 replies

9702 Posts	24 Resources

The OP

Published on 2019-8-30 22:24 Only look at the author

[Ready to use] LIS2DTW12 functional demonstration project (STM32G474) [Copy link]

LIS2DTW12 functional demonstration project uses STM32G474 microcontroller, IAR project

You can modify stm32g474.ioc through STM32CubeMX to generate other IDE full MDK projects

lis2dtw12 uses ST official standard C driver

Demo pictures:

Project Files:

stm32g474 lis2dtw12.rar (2.59 MB, downloads: 42)

This post is from MEMS sensors

Personal signature虾扯蛋，蛋扯虾，虾扯蛋扯虾

Return list

Guess Your Favourite

Just looking around

Ready to use, STM32G474 project of HST221 temperature and humidity sensor
TheprojectisbuiltusingSTM32CubeMX,STMemsStandardCofficialdriver,basedonNUCLEO-G474developmentboard
Ready to use, STM32G474 driver for LIS2MDL magnetometer
TheprojectisbuiltusingSTM32CubeMX,STMemsStandardCofficialdriver,basedonNUCLEO-G474developmentboard
OPEN SCOFIELD WINTER WARDROBE
[img]https://wwwnet/images/2024/11/14/1f9dff95d3bc981f8img][img]https://wwwnet/images/2024/11/14/2a81ca07f0c52991bimg]
Newbie Report Newbie Report
How to use CAN communication to control the inverter?
Application of TI current detection device INA series in TWS battery box
Now we need to produce a batch of calibration cards (EEPROM 24C128 + pull-up resistors for SCL and SDA signals, a total of three components...
CAN (Controller Area Network) bus batch data transmission based on SAEJ1939 wireless communication data transmission protocol
Power supply output power problem
STM32MP157A-DK1 Evaluation (4) UART and SPI Device Access

Find a datasheet?

EEWorld Datasheet Technical Support

Hot tag

Related articles more>>

Qualcomm launches its first RISC-V architecture programmable connectivity module QCC74xM, supporting Wi-Fi 6 and other protocols
On November 14, Qualcomm announced the launch of two connectivity modules, QCC74xM and QCC730M, f
It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
On November 14, according to Korean media ETNews, Samsung Electronics, SK Hynix, and Micron are a
ON Semiconductor CEO Appears at Munich Electronica Show and Launches Treo Platform
During Electronica, ON Semiconductor CEO Hassane El-Khoury was interviewed by Power Electronics N
AMD launches second-generation Versal Premium series: FPGA industry's first to support CXL 3.1 and PCIe Gen 6
SEMI: Global silicon wafer shipment area increased by 6.8% year-on-year and 5.9% month-on-month in 2024Q3
TSMC's 5nm and 3nm supply reaches "100% utilization" showing its dominance in the market
LG Display successfully develops world's first stretchable display that can be expanded by 50%
Seizing the Opportunities in the Chinese Application Market: NI's Challenges and Answers
New diaphragm-free solid-state lithium battery technology is launched: the distance between the positive and negative electrodes is less than 0.000001 meters
Photoresist giant JSR Korea EUV MOR photoresist production base started construction, expected to be put into production in 2026

New Posts

Featured

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

User Search：

Room 1530, Zhongguancun MOOC Times Building, Block B, 18 Zhongguancun Street, Haidian District, Beijing 100190, China Tel:(010)82350740 Postcode：100190

京公网安备 11010802033920号

快速回复返回顶部 Return list