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chenbingjy
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Published on 2018-12-5 17:22
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The thermal resistance θj-A of the SOT223 package of TI's LM317 data is 66.8℃/W, and considering that these data are obtained on a standard test board (seems to be 3x3 inches), generally speaking, the heat dissipation conditions are better than those on the actual PCB. The power consumption of 2W should be too large for this package. I think it would be better to control it below 1W. From the rough calculation results, it is recommended to connect a 22 ohm 3W metal film resistor in series with the input of U3 to divide the voltage. Or simply use DCDC to do it. In addition, U1 should also have similar problems, but the heat generation is slightly lower, and it may not occur at room temperature (and the current input 16V is pulled down by U3, and the power consumption is not large). If U3 resumes outputting 16V and the ambient temperature rises to, for example, more than 40℃, it may also overheat (it is also better to add a 22 ohm 3W resistor in series to divide the voltage).
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Published on 2018-12-7 14:24
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Personal signature为江山踏坏了乌骓马,为社稷拉断了宝雕弓。
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chenbingjy
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Personal signature为江山踏坏了乌骓马,为社稷拉断了宝雕弓。
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Published on 2018-12-5 17:48
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Published on 2018-12-5 18:56
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Personal signature上传了一些书籍资料,也许有你想要的:http://download.eeworld.com.cn/user/chunyang
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Published on 2018-12-5 18:59
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Personal signature上传了一些书籍资料,也许有你想要的:http://download.eeworld.com.cn/user/chunyang
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chenbingjy
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Personal signature为江山踏坏了乌骓马,为社稷拉断了宝雕弓。
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Published on 2018-12-6 17:53
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chenbingjy
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Personal signature为江山踏坏了乌骓马,为社稷拉断了宝雕弓。
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Published on 2018-12-7 14:24
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