With the in-depth research of ultrasonic levitation technology by domestic and foreign scholars, ultrasonic levitation devices have developed from expensive horns and other equipment to structures composed of general-purpose commercial ultrasonic transducers. Combined with 3D model printing technology, any scientific researcher and Electronics enthusiasts can use these components to make ultrasonic levitation devices to facilitate related acoustic research. This technology was published in AIP Publishing by Asier Marzo et al. Based on its model, this design changes the main control MCU, uses the timer inside the MCU to generate accurate PWM waves, and improves the software so that the ultrasonic device can move the suspension stably during the axial suspension movement. Small objects in multiple nodes.
View full instructions and demo: http://en.eeworld.com/bbs/thread-1078062-1-1.html
Blockdiagram
Devices | Class | introduce | Datasheet |
---|---|---|---|
GD32E231C8T6 | The embedded processor and controller;Microcontrollers and processors | Working voltage: 1.8V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M23 Main frequency (MAX): 72MHz ROM type: FLASH | Download |
All reference designs on this site are sourced from major semiconductor manufacturers or collected online for learning and research. The copyright belongs to the semiconductor manufacturer or the original author. If you believe that the reference design of this site infringes upon your relevant rights and interests, please send us a rights notice. As a neutral platform service provider, we will take measures to delete the relevant content in accordance with relevant laws after receiving the relevant notice from the rights holder. Please send relevant notifications to email: bbs_service@eeworld.com.cn.
It is your responsibility to test the circuit yourself and determine its suitability for you. EEWorld will not be liable for direct, indirect, special, incidental, consequential or punitive damages arising from any cause or anything connected to any reference design used.
Supported by EEWorld Datasheet