The weight of the iPhone 6s screen is 60g, which is 15g more than that of the iPhone 6. Not surprisingly, this is a side effect of 3D Touch. Except for the streamlined cable arrangement and slightly different layout, the screen panel of iPhone 6s is still very similar to that of iPhone 6. In order to remove the shield, the bracket housing the speaker and Facetime camera must be removed first. Although the Facetime camera has jumped from 1.2 million pixels to 5 million pixels this time, there is not much difference in appearance. With the shield removed, we finally see the 3D Touch touch IC - 343S00014. The naming method of this IC chip is very similar to that produced by Apple, but we are still not sure whether it is actually produced by Apple (I am afraid only Foxconn knows the truth). After removing the shield, we can remove the Touch ID of iPhone 6s. Apple says that Touch ID on iPhone 6s is twice as fast. This is not obvious from the hardware, but we still believe it for the time being.
After removing the screen, we return to the rose gold body. The next thing to be removed is the new Tapic Engine vibration feedback motor. We can see that the model number of the Tapic Engin module is: CTH53636EKPGG3FAV. Through X-rays, we can understand the working principle of the Tapic Engine: when we use Peek to click, the linear vibration structure of the Tapic Engine can immediately reach the peak output, forming a vibration feedback similar to tapping a finger.
Next is the battery. Use tweezers to pick up the sticker at the bottom of the battery. Then quickly pull the sticker upward with your hands, and the battery will fall off. In line with previous rumors, the battery capacity of the iPhone 6s is 1715 mAh, which is slightly smaller than the 1810mAh of the iPhone 6 last year. This is likely to provide space for the Tapic Engine and a thicker screen. But Apple said that even so, the iPhone 6s can maintain 14 hours of 3G call life and 10 days of standby time, which awaits further testing.
Next, is the 12-megapixel camera that has been significantly upgraded this year. This year's iPhone 6s camera is the first time since the iPhone 4s that the number of pixels has increased, and the increase has reached 50%. From 8 million to 12 million, it is obvious that the resolution of iPhone 6s can be greatly improved, but the reduction of single pixel area will also have a negative impact on the image quality. Apple also uses deep groove isolation technology similar to Samsung's ISOCELL sensor to alleviate this problem. This technology can reduce crosstalk between different pixels and improve photo quality.
In addition, we also found a strange hexagonal screw hole on the motherboard. When we removed it, we found that it looked very much like the antenna module from the previous model.
Then comes the moment that everyone is most looking forward to. We can finally take off the logic board and take a look at the core modules on it.
The red part is the Apple A9 processor and Samsung L
PDDR4 memory (production code K3RG1G10BM-BGCH).
The orange part is the Qualcomm MDM9635M baseband chip, which supports LTE Cat. 6 (Qualcomm MDM9625M in iPhone 6).
The yellow part is the Inmos MP67B six-axis gyroscope and accelerometer (the same as the iPhone 6).
The green part is the Bosch 3P7 LA three-axis accelerometer.
The sky blue part is Chaoqun Semiconductor TQF6405 power amplifier module.
The dark blue part is SKY77812 power amplifier module.
The purple-red part is the Avago
ACPM-8030 power amplifier module.
There is also an IC module on the front of the logic board: 57A6CV (red part)
. According to previous rumors, the A9 processor should be about 15% smaller than the A8. But from the disassembly point of view, the A9 chip area has reached 14.5 x 15 mm, which is a circle larger than the A8's 13.5 x 14.5 mm. We can't help but wonder: whether this is due to the M9 co-processor chip and something else. Are functional modules embedded?
Then let's take a look at the IC chip on the back of the logic board:
the red part is Toshiba 16GB flash memory (19nm process, model number THGBX5G7D2KLFXG).
The orange part is Huanlong Electrical WIFI baseband (model 339S00043).
The yellow part is the NXP 66V10 NFC controller (65V10 on iPhone 6).
The green part is the Dialog 338S00120 power management IC.
The sky blue part is the Cirrus Logic 338S00105 audio IC.
The dark blue part is the Qualcomm PMD9635 power management IC.
The purple-red part is SKY77357 power amplifier module.
And these:
The red part is the Murata 240 front-end module.
The orange part is the Verizon RF5150 antenna switch.
The yellow part is the NXP 1610A3.
The green part is the Cirrus Logic 338S1285 audio IC.
The sky blue part is Texas Instruments 65730AOP power management IC.
The dark blue part is the Qualcomm WTR3925 RF transceiver.
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