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Location:Training / Embedded Development / Others / Intel Package Co-EMIB / Intel Packaging ODI—all-round interconnection technology

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Intel Packaging ODI—all-round interconnection technology
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Duration：15 seconds
Date：2019/09/06

Uploader：13436496207@163

Introduction

keywords： CO-EMIB

Introduced the process of Intel's new packaging technology CO-EMIB.

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