On August 13, Tongfu Microelectronics said on the interactive platform that the company has sufficient orders and full production capacity this year, and both production and sales are booming. It is expected that the tight semiconductor production capacity will continue for a considerable period of time. The company will actively expand its production capacity, strive to meet the strong market demand, and become stronger and bigger.
Tongfu Microelectronics also pointed out that at present, the semiconductor packaging and testing capacity has been in short supply for a long time. The company can use this opportunity to communicate and negotiate with customers to adjust the cost structure and price and improve the efficiency of capacity utilization. On the one hand, it will drive the company's profitability to recover, and on the other hand, it will achieve the healthy and sustainable development of the company and its customers.
An investor asked, at present, the price of MCU chips continues to rise in the international market, will your company continue to expand the production capacity of MCU chips in the future? In addition, has your company already started the third-generation semiconductor packaging and testing business?
Tongfu Microelectronics said that the company will adjust its corresponding production capacity depending on the development prospects of MCU. The company has the ability to package and test third-generation silicon carbide semiconductors and has already started related businesses.
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