Changdian releases XDFOI multi-dimensional advanced packaging technology, which will be mass-produced in high-performance computing next year

Today, Changdian Technology, a leading global integrated circuit manufacturing and technology service provider, announced the official launch of the XDFOI™ full range of ultra-high-density fan-out packaging solutions, aiming to provide cost-effective, high-integration, high-density interconnection and high-reliability solutions for heterogeneous chip integration that is of great concern to global customers, leading the innovation of advanced chip finished product manufacturing technology to a new level.

Changdian Technology's XDFOI™ full range of ultra-high density fan-out packaging solutions is a new type of wafer-level ultra-high density packaging technology without silicon vias. Compared with 2.5D silicon via (TSV) packaging technology, it has higher performance, higher reliability and lower cost. This solution can achieve multi-layer wiring layers while the line width or line spacing can reach 2um. In addition, it uses ultra-narrow pitch bump interconnection technology, with a large package size, which can integrate multiple chips, high-bandwidth memory and passive devices.

The XDFOI™ full range of solutions integrates different functional devices into the system package, greatly reducing system costs and package size. It has a wide range of application scenarios and mainly focuses on providing chiplet (Chiplet) and heterogeneous package (HiP) system packaging solutions for application products such as FPGA, CPU, GPU, AI and 5G network chips with high requirements for integration and computing power.

Dr. Li Chunxing, CTO of Changdian Technology, said: "Moore's Law is slowing down, while the rapid development of information technology and the accelerated popularization of digital transformation have stimulated a large number of diversified computing power demands. Therefore, heterogeneous integration that can effectively improve the IO density and computing power density within the chip is regarded as a new opportunity for the development of advanced packaging and testing technology. Changdian Technology's XDFOI™ full series of solutions will expand more possibilities for heterogeneous integration with its unique technical advantages. Changdian Technology's XDFOI™ full series of solutions have now completed ultra-high-density wiring and are about to start the customer sample process. It is expected to complete product verification and achieve mass production in the second half of 2022."

Mr. Zheng Li, CEO of JCET, said: "Relying on its rich technical accumulation in the field of packaging and testing, industry-leading R&D capabilities and keen insight into technological development, JCET is actively deploying in hot technology markets. The launch of the full range of XDFOI™ solutions not only reflects JCET's strong technological innovation capabilities, but also represents a crucial step towards our goal of helping advanced packaging technology achieve disruptive breakthroughs. JCET will continue to pursue technological leadership, deepen close collaboration with upstream and downstream industries, and contribute to the sustainable development of the integrated circuit industry."