On March 8, Shanghai Xinyang released an announcement on the progress of the ASML-1400 lithography machine, stating that after active consultation and operation by all parties, the lithography equipment has entered the site of its partner Northern Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd. today, and will subsequently carry out installation, debugging and other related work.
It is disclosed that since Shanghai Xinyang initiated the R&D and industrialization project of 193nm ArF dry photoresist, it has arranged to purchase core equipment such as ASML-1400 lithography machines, and disclosed in the "Reply to the Review Inquiry Letter on the Company's Application for Issuance of Stocks to Specific Objects" on December 14, 2020 that the lithography machine will arrive in China before the end of 2020. Later, due to the communication and coordination of details such as equipment transportation and installation between the company and the lithography machine supplier, Northern Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd. (hereinafter referred to as the "Partner"), the equipment failed to arrive within the specified time, but the "Cooperation Framework Agreement" was signed with the Partner on the specific details of the cooperation, and the "Announcement on the Progress of ASML-1400 Lithography Machine and the Signing of the Northern Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd. and Shanghai Xinyang will cooperate to build a photoresist verification platform at the designated factory of Northern Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd. The platform consists of an ArF lithography machine (provided by Shanghai Xinyang) and a coating and developing machine (provided by Northern Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd.) for advanced photoresist verification. Shanghai Xinyang said that the smooth delivery of the ASML dry-process lithography equipment purchased by the company has a positive impact on accelerating the development of 193nm ArF dry-process photoresist products, which will help further enhance the core competitiveness of the company's photoresist products, accelerate the implementation of the company's development strategy, and enhance the company's risk resistance and sustainable development capabilities. It is worth noting that the lithography machine still needs to go through related links such as installation and debugging. If there are omissions or mistakes in the related links, there is a risk that the purchased lithography machine will take a long time to be put into use or even cannot be put into use. In addition, the photoresist research and development project has high technical barriers and long cycles, and it will take some time to industrialize and ultimately realize sales profits. The photolithography equipment purchased by the company is expensive, and its depreciation and subsequent maintenance costs are expected to have a certain impact on the company's operating performance.
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