Ankai Microelectronics: Overcame the problem of production capacity shortage and achieved substantial growth in performance

Guangzhou Anyka Microelectronics Co., Ltd. was established in 2001 and is headquartered in Guangzhou Development Zone, with branches in Shenzhen and Jinhua, Zhejiang.

Tianyancha shows that Ankai Microelectronics is a chip design company that provides core chips for IoT smart hardware. Its main products include IoT smart camera chips and bioinformatics smart processor chips. The company designs and sells core processor chips for mobile Internet peripheral devices, and can also provide related software system development platforms. Chip products are widely used in IoT audio and video acquisition equipment, cloud disk smart cameras, biometric devices, Bluetooth audio and data transmission equipment and other terminal products in the field of IoT and smart home.

Although affected by the epidemic in the first half of 2020 and production capacity in the second half, Ankai Microelectronics' shipments still increased significantly, and the overall performance was gratifying. Ge Baojian, director of the marketing department of Ankai Microelectronics, introduced to Jiwei.com: "This year, the company has further increased its investment in product research and development, and the progress of new product research and development has been further accelerated. The IoT smart camera product line has launched the AK39Ev330 series chips, and the IoT bioinformatics smart processor chip has launched the AK37E series chips. This year, the company officially started the research and development of chip products with advanced process technology, and some IPs have begun verification and tape-out. In the second half of 2020, wafer production and chip packaging encountered great challenges and difficulties, but with the strong support of upstream suppliers, production capacity has been basically guaranteed, and there has been no major impact on downstream supply."

It is understood that the AK39E series chips cover the current mainstream market demand for 1 to 5 megapixel resolutions, use self-developed ISP technology, support Smart H.265/H.264 encoding formats, built-in DDR, and have the characteristics of low power consumption and high cost performance. They have been widely used in the field of IoT smart cameras. The chip has been shipped in mass production to date, with a market share of more than 30% in 2020. Partner products include TP LINK, Tuya, Motorola, etc.

The semiconductor market is changing rapidly in 2020, and wafer production capacity has become the number one issue for all fabless companies. As a fabless company, Ankai Microelectronics has also been affected in terms of production capacity. However, as a chip design company founded 20 years ago, Ankai Microelectronics has established a long-term, mutually trusting cooperative relationship with wafer, packaging and other partners. With the strong support of partners, the shortage of production capacity had some impact on last year's performance, but not a big one.

Regarding the global wafer shortage, Ge Baojian said, "The global wafer processing capacity shortage will exist for quite a long time. The problem comes from the rapid growth of the IoT smart product market, 5G wireless communications, and new energy vehicles, which has led to a substantial increase in chip demand, as well as the impact of international relations. The wafer shortage in 2021 will still have some impact on Ankai Microelectronics' chip shipments. But thanks to the support of our partners, we are confident that we can meet the growing needs of our customers."

Regarding the 2021 target planning, Ge Baojian pointed out: "In 2021, Ankai Microelectronics will increase investment in the development of IoT smart camera chip products, make complete products, and make ultimate products, so as to expand market share. Product research and development directions include image resolution, machine learning computing power, and image signal processing capabilities. At the same time, we will strengthen international cooperation, establish a high-level chip design platform, and increase high-level chip designers."