It should be noted that the dead time of the control switch when the switches on the same pin are actuated simultaneously, which only occurs when the current is close to zero. Above and below a certain safety margin (FOC parameter i_margin), only one switch in a pair of switches is actively controlled.
5. Level 4
Level 4 abstract template is the bottom layer of the schematic diagram, with detailed inverter circuit. However, the simulation speed is the slowest. The simulation speed of this layer is 1/20 of the upper layer simulation speed. The inverter characteristics are built using the IGBT tool based on the Infineon IGBT datasheet.
Level 4 FOC control is implemented using C language, but the implementation function is the same as Level 3 mast language.
Level 4, the inverter is built using actual components, the FOC algorithm uses a C compiler, and the C file name is pmsm.c. Its implementation principle is exactly the same as that of Level 3.
5.1 Foc module
From the foc model description, we can see that the architecture is the same as that of Level 3, except that the algorithm calls the foc_pmsm.c file.
5.2 Inverter
Figure 11 Inverter and its parameter settings
Figure 12 Inverter model macro circuit
Figure 13 IGBT controller model macro circuit
6. Summary
This article introduces the trade-off between simulation accuracy and simulation speed in different stages of motor design, involving four modeling methods. Their characteristics are shown in the following table:
-
The DP model provides the highest simulation speed and can be used to efficiently perform cycle simulations. This model can be used to evaluate overall efficiency, evaluate load balancing, evaluate motor management strategies, and analyze long-term operating thermal simulations.
-
The averaged PWM model is suitable for motor control (FOC or DTC) optimization and analysis of drive dynamics, including torque pulses and vibrations introduced by motor imperfections.
-
Deal switch models are suitable for evaluating PWM schemes (such as sinusoidal or space vector) and fault protection strategies (fuses, redundant inverters, etc.)
-
Detailed semiconductor models are suitable for evaluating inverter stresses (maximum dI/dt and dV/dt, voltage and current spikes) and for designing gate-drive circuits with optimal switching speeds and dead times. Models at this level generate device loss tables that are used by upper-level modules.
Previous article:Disassembly of the high-voltage wiring harness safety design of the NIO ES8 electric vehicle
Next article:Schematic diagram of automobile power transmission process and analysis of structural principles
- Popular Resources
- Popular amplifiers
- Key technologies for inverter control of new energy access to smart grids
- Electric Vehicle Wireless Battery Management Revolution Has Begun and the ROI Potential Is Huge
- Three-Phase 11 kW PFC + LLC Electric Vehicle On-Board Charging (OBC) Platform User Manual (ONSEMI Semiconductor)
- IC packaging basics and engineering design examples
- Huawei's Strategic Department Director Gai Gang: The cumulative installed base of open source Euler operating system exceeds 10 million sets
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- Sn-doped CuO nanostructure-based ethanol gas sensor for real-time drunk driving detection in vehicles
- Design considerations for automotive battery wiring harness
- Do you know all the various motors commonly used in automotive electronics?
- What are the functions of the Internet of Vehicles? What are the uses and benefits of the Internet of Vehicles?
- Power Inverter - A critical safety system for electric vehicles
- Analysis of the information security mechanism of AUTOSAR, the automotive embedded software framework
Professor at Beihang University, dedicated to promoting microcontrollers and embedded systems for over 20 years.
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Please tell me the role of these two resistors in the circuit
- Is the naked-eye 3D large screen also made of light-emitting diodes (LED)? What is the principle?
- Comparison of TI's tms320 series DSP
- Playing with Zynq Serial 45——[ex64] Image Laplace Sharpening Processing of MT9V034 Camera
- New employee: I am the most idle person in the company, so my boss assigned me to write the bootloader
- I feel like I can't stay in this stupid company any longer.
- TI High Power Density Solution Analysis!
- Can the CH246 & CH241 wireless charging kit be used like this?
- Thank you for your strong faith
- Overview of MCU bus, three-bus structure of MCU