From mechanical to intelligent silicon technology leads the era of automotive design

Semiconductor technologies and products in modern cars are increasing rapidly, and consumer demand for additional features is transforming the car from a mechanical system supplemented by an electrical system to an electromechanical system that cannot function properly without an electronic system. This development trend has stimulated the market demand for high-quality, powerful and cost-effective silicon solutions.

In the past, the automotive industry has placed more emphasis on electrical systems than electronic systems. For example, lighting systems used to be designed using relays, fuses, and power switches as the main modules. Today, ST's "smart" silicon solutions are ushering the automotive industry into a new and exciting era of automotive design. This revolution is not only happening in traditional electrical systems, but also in mechanical systems. Few automakers are still using purely mechanical/electrical engine control systems, and almost all modern designs use the power of microprocessors to make the engine run efficiently and quietly, and also output power according to the driver's requirements.

As the automotive industry's reliance on semiconductors increases, semiconductor suppliers continue to develop new technologies and processes to meet the automotive industry's demand for semiconductor products. These advances are leading the automotive industry toward the ideal goal of an automotive system that is more cost-effective and integrated than today's solutions. However, these advances can only be achieved through close cooperation between semiconductor suppliers and the automotive industry, and semiconductor suppliers with broad-line products such as STMicroelectronics have recognized this relationship. This article explores some of the semiconductor technologies developed specifically for the automotive industry and the key role that the partnership between semiconductor suppliers and automakers and their Tier 1 component suppliers has played in this success.

Cooperation Model

As the complexity of automotive control systems increases and the demand for ride comfort increases, the increased investment of automakers and semiconductor suppliers exceeds the growth rate of the automotive market. The rapid investment growth and the emphasis on semiconductors urgently require semiconductor suppliers to improve product functions while reducing costs.

To achieve these goals, automakers and their Tier 1 suppliers need to rely on the expertise and processes of semiconductor suppliers like STMicroelectronics. Semiconductor suppliers input specialized technologies for semiconductor devices, and automakers and their Tier 1 suppliers also provide specialized technologies for systems. Therefore, a good communication model is very important for automotive semiconductor product development.

Traditionally, semiconductor product development in the automotive industry has been based on a hierarchical communication model, in which semiconductor suppliers communicate directly with Tier 1 suppliers, and Tier 1 suppliers communicate with semiconductor suppliers and car manufacturers respectively. This communication model works well for closed-loop systems, as Tier 1 suppliers have expertise in developing certain specific systems for the entire vehicle. However, for systems that rely on the help of other systems in the vehicle to perform the target function (open-loop systems), it is very important for car manufacturers to participate. This approach was developed for automotive industry standard systems. The group consisting of car manufacturers, Tier 1 suppliers and semiconductor suppliers is called a consortium. The consortium uses a roundtable method to establish communication channels between members, and the automotive industry is reaping the benefits of this result.

Silicon Technology Advances

Vertical Intelligent Power Technology ( VIP ower) - Replace relays with intelligent silicon devices

Since the advent of the transistor, silicon switching technology has undergone comprehensive development, however, the limitations of silicon technology mean that the application of transistors will be limited in high reliability and harsh environments (such as automobiles). In areas where silicon technology cannot be applied, electromechanical relays are a low-cost switching solution.

Now, new silicon technology is changing traditional concepts. Advanced silicon technology, such as VIPower (Vertical Intelligent Power MOS Technology) developed by STMicroelectronics, not only reduces the size of chip packages, but also increases the intelligence content inside the devices. This technology allows the development of more intelligent and user-friendly applications, such as smart headlight controllers without fuses, and smart window lifts that can detect objects such as hands or baby's heads caught in the window without special sensors.

STMicroelectronics has developed a number of silicon technologies that integrate system functions within a single semiconductor device. This technology allows control circuits to be installed together with field-effect MOS drivers, which, when used in conjunction with VIPower devices, can form a system solution.

The VIPower silicon structure allows the design of a low Rdson (on-state resistance) switch device, so that a small number of semiconductor devices can be used to drive larger loads such as DC motors, solenoid valves and car lights. STMicroelectronics is designing a combination of silicon technology and process, including a single chip intelligent controller using VIPower technology. The unique products created by the integration of silicon technology and process for the automotive industry will achieve higher functionality and better system design at a lower cost.

When designing an automotive system that drives an external load, it is important to understand the advantages and limitations of using silicon devices. STMicroelectronics has expertise and experience in internal design to determine the right semiconductor distribution for the system. To combine the system expertise of the Tier 1 component supplier and the expertise of each automotive platform developed by the car manufacturer, a powerful framework is available at all times to ensure the quality and reliability of the car.

Microcontrollers - more processing power, less power consumption

The ideal microcontroller for automotive systems should have powerful processing capabilities while also consuming very little power. This is for two reasons: systems using microcontrollers have more tasks to do, and more and more new systems are being added to automakers' vehicle platforms.

For microcontrollers, improved performance means higher operating frequencies, which creates electromagnetic conductivity (EMC) and electromagnetic susceptibility (EMS) issues. In order to meet the stringent requirements of automotive EMC and EMS, semiconductor designers have spent a lot of manpower and material resources on optimizing the circuits and layout of microcontrollers, and developed microcontroller products that can meet and exceed automotive environmental requirements.

Hardware Platform

Hardware Platform

The microcontroller core is only part of the microcontroller. The microcontroller's peripheral combination, package size, and pins are also important. For example, a microcontroller that controls the body electronics system may need a pair of accurate analog-to-digital converters (ADCs), 16-bit timers, automatic loading pulse width modulation (PWM) outputs, serial ports (SPI) to connect peripheral components, serial communication interfaces (SCI) such as K lines and LIN for communication, and even dedicated motor control outputs for directly driving stepper motors (commonly used in instrument harnesses).

By working closely with Tier 1 component suppliers and automakers, STMicroelectronics has been able to use its unique silicon technology and processes to develop a highly integrated family of microcontrollers that can be used in multiple systems on automotive platforms.

Software Platform

Software Platform

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Most automakers define their own software platform requirements. This approach enables compatibility between automotive platform systems, with the goal of enabling systems developed by different suppliers to run seamlessly and work together effectively. In order to effectively reduce development costs while improving the flexibility and durability of automotive platforms, many automakers have formed alliances to define industry standard software platforms.

The Hardware Abstraction Layer (HAL) is a defined software implementation. The idea of ​​HAL is to have an application software layer that can run without modifying any hardware platform. STMicroelectronics works closely with partners in the automotive industry to develop firmware that can easily integrate microcontrollers on automotive platforms.

Automotive Networks: Distributed Intelligence for Smart Cars

The advancement of automotive communication bus standards is the result of the growing demand for silicon products to connect the intelligent functions of automotive systems. For example, today, a car's safety system will check whether the windows are closed, the lights are off, the car is powered off, and automatically power it on before a person enters the car. These intelligent operations are only possible with the automotive network communication bus.

Today, the CAN2B standard has become the main standard for the communication bus of automotive networks. The CAN protocol is usually used to connect the powertrain and body electronic systems. The broadcast information method, collision detection and prevention method, and adaptability to special needs such as time-triggered protocols show that CAN is a powerful, widely recognized and fully supported automotive communication standard.

Local Interconnect Network (LIN) is fast becoming the new standard for low-speed, low-cost nodes in automotive networks. STMicroelectronics' LINSCI microcontroller peripheral improves functionality by adding additional hardware to a standard serial communication interface (SCI). LINSCI enables a LIN node to save microcontroller resources and reduce power consumption.

In applications that require a high-bandwidth communication bus, such as video and audio multiplexing, several standards are still under development, including MOST and Firewire. These new standards are transitioning the physical layer of automotive networks from traditional power wiring to plastic optical fiber technology (POF). This trend brings many benefits to automotive networks, such as reduced EMC and electromagnetic susceptibility, and the ability to achieve electrical isolation between automotive systems.

Wireless communication systems, such as the Global Positioning System ( GPS ), Telematics and Bluetooth technology, have brought great progress to the human-machine interaction between people and cars. These technologies have added mobile office functions to cars, enabling cars to connect in real time with Bluetooth-enabled devices such as phones, personal digital assistants (PDAs) and laptops.

Wireless communication system

Electromechanical Systems-System-on-Chip Technology

Electromechanical systems are mainly used in distributed intelligent car network structures. Each node of the electromechanical network has an electronic control device and a mechanical active structure. Typical application examples include electromechanical door locks, electromechanical rearview mirror controllers and electromechanical window lifts.

STMicroelectronics has made great efforts in System-on-Chip (SOC) technology to bring users low-cost electromechanical solutions such as microcontrollers, VIPower, network components, Flash and EEPROM memories, voltage regulators, etc. These technologies include CMOS, BiCMOS, BCD, Flash, FPGA, DRAM and MEMS (Micro-Electro-Mechanical Systems).

As SOC integrates more and more functions, the development time of automobile systems is increasingly dependent on the development time of semiconductor SOCs. Similarly, the cost of automobile systems is increasingly dependent on the cost of SOCs. Therefore, the great progress in silicon technology and processes is the most important factor in achieving high functionality and low cost of SOCs. STMicroelectronics' newly developed 90nm technology is leading the development trend of SOCs. The CMOS090 process using 90nm technology adopts a built-in modular design, which can quickly develop SOC devices with excellent performance and low power consumption.

Environmental Protection

There are not many industries whose progress in environmental governance has received widespread public attention, but the automotive industry is one example. We have seen the introduction of pollution control measures such as catalytic converters, unleaded gasoline, and engine capacity and performance limits in the automotive industry. However, no matter how much progress modern cars have made in their environmental obligations, the automotive industry needs to make greater progress. STMicroelectronics' environmental policy has provided the guarantee for the development of these processes and also proved that these policies are economically sound. As a direct result of these processes, its tin plating plant in Shenzhen consumes 13% less chemical raw materials and reduces costs by 42%. This was achieved by adjusting the equipment to use less concentrated chemical raw materials.

STMicroelectronics strives to minimize the use of hazardous substances in its products, and as a direct result of this approach we have developed a lead-free silicon packaging process called ECOPackage.

Benefits for the automotive industry

Semiconductor suppliers have expertise in silicon technology and processes. Broad-line semiconductor suppliers have expertise in multiple different silicon technologies and processes, which is a key factor in manufacturing more intelligent and cost-effective systems.

When a semiconductor company focuses on the automotive industry, these benefits will be transferred from automakers through Tier 1 component suppliers to consumers. The roundtable forum brings together the expertise of automakers, Tier 1 component suppliers and STMicroelectronics to produce the best feasible automotive network and system solutions.

Today, the automotive industry is reaping the rewards of its hard work. We see more and more cars on the road equipped with "smart" systems, and these are not high-end luxury cars, but more and more economical cars are also equipped with these systems. The cost structure of new cars is more closely related to the cost of semiconductor products, and the progress of silicon technology is reducing the cost of new cars. Cars are becoming more and more intelligent, while the cost is getting lower and lower. We can't imagine what the cars of the future will look like, but all of us are looking forward to technological advances that will make future transportation more comfortable.