Automotive-grade MCU "lane-changing" competition

Among them, in the field of electric transmission and chassis systems, the CoreDrive E3 series high-performance MCU covers core ECUs such as electric drive, BMS, OBC, DC-DC, and active suspension, and is the first to achieve stable mass production and shipment. The CoreDrive E3 series MCU products were used in the OBC+DCDC project created by Weirui Energy, and were successfully mass-produced on models such as smart elf #1, smart elf #3, and Zeekr X and exported to Europe.

At the same time, Dongfeng Yipai eπ008 is also equipped with the CoreChi G9 series central gateway chip, which supports the SOA gateway for the next-generation EE architecture and covers the left and right body domain control. During this year's Beijing Auto Show, the company also released a new generation of central processors and regional controller automotive chip product families for the first time, supporting the "1+N" central computing + regional control architecture.

This means that for the first time, Chinese companies are on the same starting line as overseas chip giants, which is of great significance especially for the high-performance MCU track with extremely high entry barriers.

Among them, E3650 adopts the latest ARM Cortex R52+ high-performance lock-step multi-core cluster, supports virtualization, non-volatile memory (NVM) up to 16MB, has large-capacity SRAM, and more abundant available peripheral resources, which solves the pain points encountered in the current vehicle electrical architecture design and supports the realization of higher integration and wider configuration of vehicle electronic and electrical architecture.

At the same time, on E3650, Xinchu has also upgraded the self-developed SSDPE (Super Speed ​​Data Packet Engine) hardware communication acceleration engine, which can achieve zero data packet loss when all CAN FD work simultaneously, effectively reducing the CPU load and improving the communication throughput.

In the view of Gaogong Intelligent Automobile Research Institute, as the automotive-grade MCU market gradually completes the upgrade from distributed applications and low performance to centralized and high-performance tracks, market players and patterns will also undergo new changes. Overcapacity in the low-end market and competition in cost-performance in the high-end market will be the new trend.