Molex is revolutionizing transportation by advancing electric vehicle technology through miniaturized design
Chengdu, Sichuan – August 6, 2024 – The major development trend of the automotive industry towards electrification, intelligence, networking and lightweighting has driven the continued surge in demand for advanced components for electric vehicles (EVs). According to the latest automotive market data for the first half of April released by the Passenger Car Market Joint Branch of the China Automobile Dealers Association, the retail penetration rate of China's new energy vehicles (mainly electric vehicles) market exceeded 50% for the first time, indicating that the electrification development trend of China's automotive market has reached a new milestone.
Electrification has not only accelerated the integration of intelligent and networked functions of various models, but also promoted the improvement of electric vehicle design and infrastructure. According to the latest information from the China National Information Center, the main considerations for mainstream consumers when choosing and purchasing electric vehicles include driving range and purchase cost. In addition, functions and performance, appearance, comfort and interior space are also important considerations for their car purchases.
Consumers' purchasing preferences and habits are constantly changing, which undoubtedly brings huge challenges to vehicle design. The electrification, intelligence and networking of vehicles will increase the proportion of electronic products in the whole vehicle. These electronic products will increase the overall weight of the vehicle, reduce the vehicle's range, and take up more interior space. Molex's research shows that to achieve the basic electrification, intelligence and networking functions of a vehicle, at least 80 electronic control units (ECUs), 100 sensor systems, 30 kilograms of copper wires, and 60 kilograms of cables are required.
Given this, it is imperative for Chinese electric vehicle manufacturers to prioritize miniaturization to optimize vehicle design, whether by reducing weight or saving space. As the automotive industry continues to explore the trend of electrification, miniaturization becomes the key to achieving streamlined and efficient electric vehicle design.
“For more than 80 years, Molex has been committed to promoting innovative interconnect solutions, and we have decades of rich experience and technical knowledge in serving the local and global automotive industries. The expert team at our China Business and Design Center in Chengdu is the backbone of Molex’s global design, engineering and manufacturing infrastructure. Their cross-disciplinary expertise and unparalleled collaboration are key to helping many major Chinese electric vehicle manufacturers meet their evolving miniaturization needs. Crucially, while reducing product size, Molex has also increased the functionality provided by the system, improved system performance, and ensured high reliability in the harsh environments required by the automotive industry. We strive to design and develop products that meet the needs of local and global customers, and we are proud that the Chengdu team has played an important role in bringing these key solutions to our local customers in China.” Donne Liu, business director of Molex China, said: “Molex has been committed to promoting innovative interconnect solutions for more than 80 years, and we have decades of rich experience and technical knowledge in serving the local and global automotive industries. The expert team at our China Business and Design Center in Chengdu is the backbone of Molex’s global design, engineering and manufacturing infrastructure. Their cross-disciplinary expertise and unparalleled collaboration are key to helping many major Chinese electric vehicle manufacturers meet their evolving miniaturization needs. Critically, while reducing product size, Molex has also increased the functionality provided by the system, improved system performance, and ensured high reliability in the harsh environments required by the automotive industry. We strive to design and develop products that meet the needs of local and global customers, and we are proud that the Chengdu team has played an important role in bringing these key solutions to our local customers in China.”
In the Chinese market, the main solutions Molex currently provides in this field include:
• Molex DuraClik 2.00mm pitch wire-to-board connectors with terminal retainer option provide stable mating and high PCB retention for applications requiring high vibration resistance.
This series of rugged products is a simple and effective solution that provides fast and secure connections in high-vibration environments. These automotive-grade products feature independent secondary locks (ISL), inertia locking, and retention forces up to 100N. As one of Molex's strongest and most numerous derivatives, the DuraClik ISL connector remains one of the smallest options on the market, helping to solve space issues and reduce weight.
The DuraClik wire-to-board connector is rated for ambient temperatures of -40 to +125°C, maintaining performance in high-temperature applications such as lighting systems. It also meets LV214 and ES91500-03 specifications to meet the requirements of the European, Chinese and US automotive markets.
• Molex Mini50 connectors, available in sealed or unsealed Mini50 single- and dual-row receptacles, offer 50% space savings and smaller terminals compared to traditional USCAR 0.64mm connectors, accommodating more low-current circuits in interior transportation and vehicle environments.
The proliferation of automotive infotainment and safety product options has led automakers to demand smaller interconnects from suppliers, with the need to fit more electronics in the same space. Mini50 sealed and unsealed wire-to-board receptacles enable device manufacturers to package circuits in tighter spaces while using smaller pins, terminals and wire gauges to reduce costs.
Assembly errors and the harsh, high-vibration environment of automotive applications put connection reliability at risk. Improper terminal insertion, operator fatigue, and disconnection due to shock and vibration all pose risks to connections. In response, the Mini50 Gen II unsealed connector system offers many innovations to provide more reliable connections. The plug-in terminal clamp is suitable for cables 0.35 square millimeters and thinner. Compared with traditional USCAR 0.64 mm connectors, Mini50 single-row and dual-row sockets can save up to 50% of space. At the same time, due to the reduction in wire diameter, system weight, space and cost can be greatly reduced. The Mini50 connector uses a high-temperature thermoplastic housing that can withstand infrared (IR) and peak lead-free soldering processes and meets the ES-40000-5013 Molex specification with a maximum temperature of +260°C.
“As electric vehicles continue to demand more range, functionality and comfort, the trend toward miniaturization of all electronic control systems in automotive design is set to continue,” Lui concluded. “Molex is committed to providing optimized miniaturization solutions that deliver more functionality and performance, as well as reliability in harsh environments, while achieving miniaturization.”
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