Andes Technology, Hirain Technology, and Pioneer Semiconductor collaborate to expand AUTOSAR

Andes Technology, Hirain Technology, and HPMicro jointly announced that the three parties will work together to build a RISC-V automotive electronics ecosystem by combining the AndesCore RISC-V processor series, HPMicro HPM6200 full-line products, and Hirain's in-vehicle OS software platform solutions. In this cooperation, Hirain's AUTOSAR product INTEWORK-EAS will be adapted to the HPM6200 products of HPMicro, supporting the MCAL software adaptation and engineering integration of the HPMicro AUTOSAR solution. Hirain is one of the few major AUTOSAR software suppliers with experience in supporting multiple RISC-V automotive-grade chips. Hirain has always been an active participant in the RISC-V AUTOSAR ecosystem. The HPM6200 product line has a total of 12 product models, with AndesCore D45 single-core or dual-core RISC-V processors built in. This series of products has the characteristics of high performance and real-time performance, and its application areas include new energy, energy storage, industrial automation, electric vehicles, etc. Through this cooperation, HPMicro's chip products will provide more services for different application scenarios of automotive electronics. Improved functions and services will enhance the compatibility of RISC-V technology in the field of automotive electronics. In the future, Hirain and Pioneer Semiconductor will continue to cooperate and continue to provide AUTOSAR software platform solutions for new products.

INTEWORK-EAS is a software product independently developed by Hirain Technology that complies with the AUTOSAR standard. It has a complete AUTOSAR tool chain, is compatible with a variety of mainstream data formats in the industry, such as DBC, LDF, PDX, ODX, ARXML, etc., and supports seamless integration with third-party MCAL tool chains. The solution covers various aspects such as standard embedded software, AUTOSAR tool chain, integration services and training, aiming to provide OEMs and suppliers with a stable, reliable, convenient and easy-to-use AUTOSAR platform. Hirain Technology attaches great importance to the construction of integrated hardware and software solutions. The INTEWORK-EAS series of products have been widely mass-produced and verified on internationally renowned SoC platforms. Hirain Technology continues to deepen its cooperation with chip companies to jointly provide more integrated hardware and software solutions for the automotive market. For Jingwei Hirain, this cooperation with HPMicro has added a new important company to its list of chip partners and consolidated its leadership in the AUTOSAR ecosystem.

The HPM6200 from Pioneer Semiconductor uses the D45 core, an 8-level dual-issue superscalar design, a main frequency of 600 MHz, a performance of more than 3390 CoreMark and 1710 DMIPS, and supports single/double-precision floating-point units (FPU) and RISC-V P (draft) instructions (DSP/SIMD) that comply with the IEEE754 standard. The D45 core also has a memory subsystem that supports configurable instruction and data caches and local memory, further improving the software performance of the HPM6200 series SoC. In terms of the application market, the D45 core is very suitable for embedded applications that have special requirements for fast response time and high computing accuracy.

In addition to high computing power, the HPM6200 product also integrates a series of high-performance peripherals and external storage. In addition, the HPM6200 series also provides an enhanced PWM control system and a programmable logic array PLA for complex signal generation. HPM6200 integrates AES-128/256, SHA-1/256 acceleration engine and hardware key manager, which can support software and hardware signature authentication, secure boot and encrypted execution to prevent illegal code replacement, tampering or copying, and further improve security. HPMicro has completed ISO9001 quality management certification and ISO 26262 functional safety management system ASIL D certification. The entire line of HPM6200 products has passed AEC-Q100 G1 certification with an operating temperature range of -40°C to 125°C. After Hengrun Technology INTEWORK-EAS is adapted to HPM6200, the package solution will be fully promoted in China and other automotive markets around the world.

The head of embedded software department of Hirain Technologies said: "We are very pleased to cooperate with Andes Technology and HPMicro. The three parties jointly create a RISC-V-based hardware and software integrated solution, targeting the growing automotive market. In this era of rapid chip iteration, it is very important to fully utilize the advantages of AUTOSAR middleware. We have strong support capabilities for new hardware platforms, and this cooperation will once again prove this. In the future, we hope to work with more partners to provide integrated solutions and promote them to the automotive industry."

HPMicro CEO Zeng Jintao said: "The D45 processor can provide high performance and low latency for HPMicro's MCU series products that require ultra-high-speed real-time processing. Time calculation. The CPU performance is excellent and can surpass other competing products in certain test environments. Andes Technology's technical support helped us quickly and successfully complete the tape-out of the HPM6000 series. The two teams have a close and efficient cooperation. For HPMicro, this AUTOSAR cooperation with Jingwei Hirain means that HPMicro products have been widely recognized by the industry and can promote the application of high-performance microcontroller products using Andes' RISC-V core in the field of new energy electric vehicles."

Dr. Hongmeng Su, President and CTO of Andes Technology, said: "The D45 core and HPMicro HPM6200 SoC provide developers with a versatile hardware platform, enabling customers to design software with higher performance and more features. This collaboration with HiRain Technologies and HPMicro sets a good example for the industry to promote RISC-V MCUs to a wider range of automotive applications. We look forward to participating in more similar collaborations in the future to jointly promote excellent products to the automotive electronics industry."