Leapmo held a press conference without a model to announce the centrally integrated electronic and electrical architecture LPEE 3.0, officially named the "Four-leaf Clover" architecture. This is the previously rumored centrally integrated electronic and electrical architecture of Leapao. EE architecture.
For ordinary consumers, it may not be noticeable, but it is nothing less than a "blockbuster" in the industry. Let's put it this way, no one in China can achieve a highly integrated centrally integrated electronic and electrical architecture. This means Among the new independent forces, Leapao has taken the lead and has the highest degree of central integration and is the closest to what future cars should look like.
Previously, only Tesla could achieve a similar level in the industry .
Moreover, this is not just PPT, but a real technological innovation. According to the official introduction, the first model will be launched in September this year, and will subsequently appear on all models under the Leapmo brand.
What should the car of the future look like?
Delphi proposed a concept as early as 2007 to effectively integrate the car's sensors, CPU, electronic and electrical distribution systems, hardware, and software. However, limited by the functional requirements and laws and regulations at the time, this concept was only a solution for physical layout, new number network, data network, diagnosis and power management. Ten years later, as Tier 1, Bosch has established the evolution direction of future automotive electronic and electrical architecture based on the gradually clear development path.
This context clearly introduces what the electronic and electrical architecture of future automobiles should look like from the emergence of distributed electronic and electrical architecture in 1970.
Volkswagen is anxious to cooperate with SAIC. Mercedes-Benz has introduced Nvidia as a partner, BMW has joined forces with Qualcomm, and everyone is actively trying to save themselves.
Talking about the centrally integrated electronic and electrical architecture of the Zero-Economy "Four-Leaf Clover", why is it said to be able to keep pace with Tesla? The electronic and electrical architecture determines the upper limit of the intelligence of the entire vehicle. It realizes the integration of the cockpit domain, power domain, body domain and intelligent driving domain. It is only one chassis domain away from achieving the ultimate goal of integrating five domains. It is currently among the top in the industry. level.
The central supercomputer makes unified decisions, and regional connections are responsible for execution. With the support of high computing power and high collaboration, communication delays are reduced. Maybe everyone has no idea about this matter. We can look at some detailed parameters of the models currently sold in the industry and compare the advantages of the centrally integrated electronic and electrical architecture.
autonomous driving functions, which is obviously not suitable for future automobile development.
Four-domain fusion central supercomputing
"Clover" uses a central supercomputer to realize the integration of the cockpit domain, power domain, body domain and intelligent driving domain. The supercomputing platform is embedded with vehicle control, body control, gateway management, thermal management, instrument information system, There are 15 modules in total including in-vehicle entertainment system, 360° surround view, APA parking, fatigue monitoring, life monitoring, driving records, sentry mode, sound alarm, DS P amplifier, and video conferencing. It is equivalent to a set of boxes integrating the original 15 boxes. .
This central supercomputing platform is equivalent to the left and right brains. The right brain SoC motherboard is responsible for intelligent cockpit and intelligent driving, and the left brain MCU motherboard is responsible for vehicle control and body control.
The supercomputing platform can realize switching between different chips. It is composed of a Qualcomm 8295/8115 SoC chip and an NXP S32G MCU chip. It reduces the number of redundant ECUs and cooperates with Gigabit Ethernet and 5G communications to solve the problem after multi-domain integration. Central supercomputing platform data communication and computing power issues.
In addition, NVIDIA Orin-X enhanced computing power is provided for high-end intelligent driving models with lidar. Therefore, there are three sets of standard, mid-range and high-end solutions for different needs:
Standard plan
Hardware Qualcomm 8155+NXP S32G (3 cores)
Supports 6~12 speakers, 4 screens, AR-HUD
Supports 4-channel surround view cameras, 1-channel face camera, and 12-channel ultrasonic radar
Mid-range plan
Qualcomm 8295+NXP S32G (7 cores), with 30TOPS computing power
Supports up to 20+ speakers (external power amplifier), 4 channels of 2.5K resolution, 1 channel of 1080P, 2 channels of 720P
Supports 4-way surround view cameras to achieve L2/L2+ intelligent assisted driving
High configuration plan
Qualcomm 8295 + NXP S32G (7 cores) + NVIDIA Orin-X, the whole vehicle has 284TOPS computing power
Supports up to 20+ speakers (external power amplifier), 4 channels of 2.5K resolution, 1 channel of 1080P, 2 channels of 720P
Supports lidar, high-precision maps, 4-way surround-view cameras, 4-way blind spot cameras, and 4-way blind spot corner radar to achieve L2++ level high-end intelligent assisted driving
software level
There is hardware support, but also software matching. The "Clover" software architecture system integrates instrument systems, image systems, sound systems, multimedia systems, central gateways, ADAS systems, ECU systems, and CAN systems, and can implement Android, QNX , Linux OS, RTOS x3 four systems are running. Implement SOA service architecture through standardized interface design.
The current domain control architecture has a large number of code bases that are fragmented and difficult to coordinate. Therefore, it is not enough for users to define their own car permissions. The solution of Leapao has reserved more than 500 interfaces to realize software-defined cars.
This step has been planned for a long time, and I want to catch up in at least a few years.
Why can Leapao implement a centrally integrated electronic and electrical architecture in 2023, and integrate four major domains with one SOC + one MCU. The integration of the chassis domain is also a matter of time. And others need to wait until 2025 or even later?
Whether automobile companies can quickly achieve multi-domain integration and more easily and efficiently coordinate the software and hardware of different modules lies in their ability to control technology, that is, whether they have the ability to conduct self-research across all domains. It sounds simple, but it requires a lot of cost investment.
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