A team from the Massachusetts Institute of Technology in the United States has successfully developed a new nanoscale 3D transistor using ultra-thin semiconductor materials. This is the smallest 3D transistor known to date, and its performance and functions are comparable to or even exceed those of existing silicon-based transistors, which will open up new avenues for the development of high-performance energy-saving electronic products. The relevant paper was published in the journal Nature Electronics on the 5th.
"Artistic photo" of the new transistor. Image source: Massachusetts Institute of Technology official website
Transistors are basic components in modern electronic devices and integrated circuits, with a variety of important functions, including amplifying and switching electrical signals. However, due to the basic physical limitation of "Boltzmann's tyranny", silicon-based transistors cannot operate below a certain voltage, which undoubtedly limits their further performance improvement and expansion of their application range.
To break this bottleneck, the team used ultra-thin semiconductor materials composed of gallium antimonide and indium arsenide to develop this new type of 3D transistor. The performance of this transistor is comparable to that of the most advanced silicon transistors currently available, and it can operate efficiently at a voltage much lower than that of traditional transistors.
The team also introduced the principle of quantum tunneling into the new transistor architecture. In the quantum tunneling phenomenon, electrons can pass through rather than over energy barriers, making it easier to turn the transistor on or off. To further reduce the size of the new transistor, they created a vertical nanowire heterostructure with a diameter of only 6 nanometers.
Test results show that the new transistor can switch states more quickly and efficiently, with performance 20 times higher than similar tunneling transistors.
This new transistor takes full advantage of quantum mechanics to achieve low-voltage operation and high performance within a few square nanometers. Due to the extremely small size of the transistor, more of it can be packed on a computer chip, which will lay a solid foundation for the development of more efficient, energy-saving and powerful electronic products.
Currently, the team is working on improving the manufacturing process to ensure the consistency of transistor performance across the entire chip. At the same time, they are also actively exploring other 3D transistor designs, such as vertical fin structures.
Previous article:Ultra-thin film capable of absorbing multi-band electromagnetic waves has been successfully developed
Next article:最后一页
- Popular Resources
- Popular amplifiers
- ASML provides update on market opportunities at 2024 Investor Day
- It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
- Intel China officially releases 2023-2024 Corporate Social Responsibility Report
- Mouser Electronics and Analog Devices Launch New E-Book
- AMD launches second-generation Versal Premium series: FPGA industry's first to support CXL 3.1 and PCIe Gen 6
- SEMI: Global silicon wafer shipment area increased by 6.8% year-on-year and 5.9% month-on-month in 2024Q3
- TSMC's 5nm and 3nm supply reaches "100% utilization" showing its dominance in the market
- LG Display successfully develops world's first stretchable display that can be expanded by 50%
- Infineon's revenue and profit both increased in the fourth quarter of fiscal year 2024; market weakness in fiscal year 2025 lowered expectations
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- CGD and Qorvo to jointly revolutionize motor control solutions
- CGD and Qorvo to jointly revolutionize motor control solutions
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Infineon's PASCO2V15 XENSIV PAS CO2 5V Sensor Now Available at Mouser for Accurate CO2 Level Measurement
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- Hardware outlet] RK3399 realizes dual network ports
- Lora rate comparison table
- RS485 communication interface problem
- Summary of the Beginner's Guide to 28335
- Matlab Machine Learning (English and Chinese subtitles)
- 【NXP Rapid IoT Review】+Preparation for Data Download
- 10 common basic knowledge of MCU
- [RT-Thread reading notes] The simplest port to STM32F103CBT6
- I am 31 years old, I have been coding for 10 years, and I will retire tomorrow!
- Evaluation of domestic single-chip networking chips