Definition of LED Thermal Management

Publisher:月光男孩Latest update time:2011-03-31 Source: 互联网Keywords:LED Reading articles on mobile phones Scan QR code
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LED thermal management technology includes thermal management of chips, packaging and system integration. In terms of chips, people strive to improve the crystal quality of materials or design new structures to improve the internal and external quantum efficiency of the chip itself, which is smaller than the thermal resistance of traditional low thermal conductivity sapphire substrate chips.

Chip (quantum efficiency; power density; heat flux expansion; substrate material, etc.)

LED thermal management packaging (packaging materials; packaging structure; packaging process, etc.)

System integration (refrigeration technology; materials; processes, etc.)

LED heat dissipation structure description (illustration path: use illustration LED heat dissipation structure description)

1. Necessity of LED heat dissipation (heat dissipation is the technical bottleneck of current semiconductor lighting technology)

LED is a photoelectric device. During its operation, only 10% to 40% of the electrical energy is converted into light energy, and the rest of the electrical energy is almost converted into heat energy, which increases the temperature of the LED. LED temperature rise is the main cause of LED performance degradation and failure. The increase in LED junction temperature leads to reduced luminous efficiency, poor reliability, reduced service life and increased heat generation.

2. Solution

Overview of LED Thermal Management

(A) Improve the structure and materials of LED chips and packaging - completed by upstream and midstream industries

(B) System integration, mainly for lighting heat dissipation methods, improving heat exchange power - heat dissipation design work

3. Analysis of the heat dissipation structure of LED lamps

Chip (node ​​temperature is controlled at <85℃) - (products with low thermal resistance are conducive to heat dissipation) - lamp beads Substrate - aluminum substrate (increasing the copper coating area is conducive to heat conduction) - (using thermal conductive silicone) - heat sink shell lamp (good structure facilitates air convection) - surrounding environment


Keywords:LED Reference address:Definition of LED Thermal Management

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