The EMI interference sources of the switching power supply are concentrated in the power switch tube, rectifier diode, high-frequency transformer, etc. The interference of the external environment to the switching power supply mainly comes from the jitter of the power grid, lightning strikes, external radiation, etc.
1. EMI sources of switching power supplies
The EMI interference sources of the switching power supply are concentrated in the power switch tube, rectifier diode, high-frequency transformer, etc. The interference of the external environment to the switching power supply mainly comes from the jitter of the power grid, lightning strikes, external radiation, etc.
(1) Power switch tube
The power switch tube works in a state of rapid On-Off cycle conversion, and both dv/dt and di/dt change rapidly. Therefore, the power switch tube is the main interference source of both electric field coupling and magnetic field coupling.
(2) High frequency transformer
The EMI source of high-frequency transformers is mainly reflected in the rapid cycle change of di/dt corresponding to leakage inductance. Therefore, high-frequency transformers are an important interference source of magnetic field coupling.
(3) Rectifier diode
The EMI source of the rectifier diode is concentrated in the reverse recovery characteristics. The discontinuity point of the reverse recovery current will produce high dv/dt in the inductor (lead inductance, stray inductance, etc.), resulting in strong electromagnetic interference.
(4) PCB
To be precise, PCB is the coupling channel of the above-mentioned interference sources. The quality of PCB directly corresponds to the quality of suppression of the above-mentioned EMI sources.
2. Classification of switching power supply EMI transmission channels
1. Transmission channel of conducted interference
(1) Capacitive coupling
(2) Inductive coupling
(3) Resistive coupling
a. Resistive conduction coupling caused by the internal resistance of the common power supply
b. Resistive conduction coupling caused by common ground impedance
c. Resistive conduction coupling caused by common line impedance
2. Transmission channel of radiated interference
(1) In a switching power supply, components and wires that can constitute a radiation interference source can be assumed to be antennas, and thus analyzed using the electric dipole and magnetic dipole theory; diodes, capacitors, and power switches can be assumed to be electric dipoles, and inductors can be assumed to be magnetic dipoles;
(2) When there is no shield, the electromagnetic wave transmission channel generated by electric dipoles and magnetic dipoles is air (which can be assumed to be free space);
(3) When there is a shield, the gaps and holes in the shield are considered and analyzed according to the mathematical model of the leakage field.
[page]
3. 9 measures to suppress EMI in switching power supply
In switching power supplies, sudden changes in voltage and current, i.e. high dv/dt and di/dt, are the main causes of EMI. Technical measures for implementing EMC design of switching power supplies are mainly based on the following two points:
(1) Minimize the interference source generated by the power supply itself, use interference suppression methods or components and circuits that generate less interference, and arrange them reasonably;
(2) Suppress the EMI of the power supply and improve the EMS of the power supply through grounding, filtering, shielding and other technologies.
Separately speaking, the nine measures are:
(1) Reduce dv/dt and di/dt (reduce their peak values and slow down their slopes)
(2) Reasonable application of varistor to reduce surge voltage
(3) Damping network suppresses overshoot
(4) Use diodes with soft recovery characteristics to reduce high-frequency EMI
(5) Active power factor correction and other harmonic correction technologies
(6) Use a properly designed power line filter
(7) Reasonable grounding treatment
(8) Effective shielding measures
(9) Reasonable PCB design
4. Control of leakage inductance of high-frequency transformer
The leakage inductance of the high-frequency transformer is one of the important reasons for the generation of the peak voltage when the power switch is turned off. Therefore, controlling the leakage inductance becomes the primary problem to be faced in solving the EMI caused by the high-frequency transformer.
There are two entry points to reduce the leakage inductance of high-frequency transformers: electrical design and process design!
(1) Choose a suitable magnetic core to reduce leakage inductance. Leakage inductance is proportional to the square of the number of turns on the primary side. Reducing the number of turns will significantly reduce leakage inductance.
(2) Reduce the insulation layer between windings. There is now an insulation layer called "gold film" with a thickness of 20 to 100 um and a pulse breakdown voltage of several thousand volts.
(3) Increase the coupling between windings and reduce leakage inductance.
5. Shielding of high frequency transformer
In order to prevent the leakage magnetic field of the high-frequency transformer from interfering with the surrounding circuits, a shielding tape can be used to shield the leakage magnetic field of the high-frequency transformer. The shielding tape is generally made of copper foil, wrapped around the outside of the transformer and grounded. The shielding tape is a short-circuit ring relative to the leakage magnetic field, thereby suppressing the leakage of the leakage magnetic field in a wider range.
In high-frequency transformers, relative displacement occurs between the magnetic cores and windings, which causes noise (howling, vibration) to be generated during operation. To prevent this noise, reinforcement measures need to be taken for the transformer:
(1) Use epoxy resin to bond the three contact surfaces of the core (such as EE and EI cores) to suppress the occurrence of relative displacement.
(2) Use "glass beads" adhesive to bond the magnetic core for better results.
Previous article:Austrian Microelectronics launches highly integrated environmental noise suppression chip
Next article:Share: Forward topology/passive PFC
Recommended ReadingLatest update time:2024-11-16 22:23
- Popular Resources
- Popular amplifiers
- Study on the Behavioral Model of Silicon Carbide MOSFET Power Module and EMI Prediction of Low-Voltage Auxiliary Power Supply
- Cable radiated EMI modeling considering mutual coupling effects_Junpeng Ji
- Design of broadband hybrid active EMI filter for switching power supply_Liao Yuehong
- Switching power supply conducted EMI simulation and filter circuit design_Jiang Yunfu
- MathWorks and NXP Collaborate to Launch Model-Based Design Toolbox for Battery Management Systems
- STMicroelectronics' advanced galvanically isolated gate driver STGAP3S provides flexible protection for IGBTs and SiC MOSFETs
- New diaphragm-free solid-state lithium battery technology is launched: the distance between the positive and negative electrodes is less than 0.000001 meters
- [“Source” Observe the Autumn Series] Application and testing of the next generation of semiconductor gallium oxide device photodetectors
- 采用自主设计封装,绝缘电阻显著提高!ROHM开发出更高电压xEV系统的SiC肖特基势垒二极管
- Will GaN replace SiC? PI's disruptive 1700V InnoMux2 is here to demonstrate
- From Isolation to the Third and a Half Generation: Understanding Naxinwei's Gate Driver IC in One Article
- The appeal of 48 V technology: importance, benefits and key factors in system-level applications
- Important breakthrough in recycling of used lithium-ion batteries
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Summary by an expert: Answers to 23 classic questions in power supply development!
- What is the difference between these two ways of connecting the max680 capacitor?
- 2G/GPS/Bluetooth or Zigbee IoT communication module
- Application of ZigBee in intelligent management of production lines
- COCOFLY Tutorial - Crazy Shell Drone Series · Quick Start · [4] Flight Control Firmware Burning
- The Zhongke Yihaiwei FPGA board is unboxed!
- Share a video series by Hou Jie C++
- GD32L233C-START Evaluation (3) On-chip hardware oversampling ADC
- If a device made of a single-chip microcomputer is completely powered off every half an hour, will it be easy to break down?
- Anxinke PB-02 module review (3) - PHY62XX GPIO usage guide