Toshiba Launches Automotive 40V N-Channel Power MOSFET in New High Heat Dissipation Package to Support Higher Current Needs of In-Vehicle Equipment

Toshiba Launches Automotive 40V N-Channel Power MOSFET in New High Heat Dissipation Package to Support Higher Current Needs of In-Vehicle Equipment

Shanghai, China, February 3, 2023 - Toshiba Electronic Devices & Storage Corporation ("Toshiba") announced the launch of automotive 40V N-channel power MOSFETs "XPQR3004PB" and "XPQ1R004PB" in the new L-TOGL™ (Large Transistor Outline Gull Wing Lead) package. These two MOSFETs feature high rated drain current and low on-resistance. Product shipments start today.

In recent years, as the demand for electric vehicles has grown, the industry has also been demanding components that can meet the higher power consumption of in-vehicle equipment. These two new products use Toshiba's new L-TOGL™ package, which supports high current, low on-resistance and high heat dissipation. Instead of using an internal terminal[1] structure, the above products integrate the source connector and external pins by introducing a copper clip. The source pin adopts a multi-pin structure, which reduces the package resistance by about 30% compared to the existing TO-220SM(W) package, thereby increasing the drain current rating (DC) of the XPQR3004PB to 400A, 1.6 times higher than the current product[2]. The use of a thick copper frame reduces the channel-to-case thermal resistance in the XPQR3004PB to 50% of the current product[2]. These characteristics help achieve higher currents and reduce losses in in-vehicle equipment.

The new packaging technology can further simplify heat dissipation design and significantly reduce the number of MOSFETs required for applications that require high current, such as semiconductor relays and integrated starter generator inverters, thereby helping to reduce the size of the system. When multiple devices need to be connected in parallel to provide higher operating current for the application, Toshiba supports group shipment of these two new products [3], that is, grouping products by gate threshold voltage. This ensures that the design uses products from the same group, thereby reducing characteristic deviations.

Because in-vehicle devices may work in various temperature environments, the reliability of surface mount solder joints is a key factor to consider. The new product uses gull-wing pins to reduce mounting stress and improve solder joint reliability.

application:

-In- vehicle equipment: inverters, semiconductor relays, load switches, motor drivers, etc.

characteristic:

-New package L-TOGL™

-High drain current rating:

XPQR3004PB: ID=400A

XPQ1R004PB:ID=200A

- AEC-Q101 qualified

-Low on-resistance:

XPQR3004PB: RDS(ON) = 0.23mΩ (typical) @ VGS = 10V

XPQ1R004PB: RDS(ON)＝0.8mΩ（typ）@VGS＝10V

Key specifications:

Note:

[1] Soldering connection

[2] High current product: TKR74F04PB in TO-220SM(W) package

[3] Toshiba offers grouped shipments with a gate threshold voltage floating range of 0.4V per reel. However, specification of a specific group is not allowed. Please contact Toshiba sales representative for more information.