Vicor to showcase innovative ways to fully unleash xPU performance at OCP China Day 2022
Vicor will share its new innovative approach to solving today’s toughest high-performance computing challenges. Siyu Chai, global product manager for AI/Compute market, will present “Advances in Current Multiplication Technology Enable New AI Processor Power Solutions” at OCP China Day 2022 on August 10 in Beijing, China .
While top-tier xPUs have the power to support today’s most demanding applications, power limits overall system performance. As power levels for AI processors continue to rise, core voltages drop with advanced process nodes, which results in increasing PDN impedance drops and power losses, limiting processor efficiency.
Vicor provides lateral power, vertical power, and new lateral-vertical power solutions using factorized power architecture (FPA) and current multiplication. Ms. Chai will discuss impedance issues and their impact on PDN losses associated with processor core voltage. Advances in power module packaging, next-generation current multiplication, and current density will also be presented. These technologies enable current requirements of tens of kiloamperes for chip-level and cluster computing AI systems.
Visit the Vicor booth to see demonstrations of our innovative power delivery solutions for AI and machine learning applications, some of which use advanced cooling technologies.
Vicor technical experts will discuss advanced point-of-load, lateral, vertical and lateral-vertical power delivery solutions that can unleash the performance of the xPU.
Date: August 10, 2022
Location: Kerry Hotel, Beijing
Vicor Presentation: Advances in Current Multiplication Technology Enable New Power Solutions for Artificial Intelligence Processors
Topic 1: Open Data Center Infrastructure 15:40-16:10
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