Groundbreaking Quad-Row Board-to-Board Connector Now Commercially Available
• The world’s smallest board-to-board connector is ideal for space-constrained smartphones, smartwatches, wearables, and augmented reality/virtual reality devices
• Staggered circuit layout saves 30% space compared to traditional connector design
• Robust features enhance more reliable performance
• More than 50 million units shipped since 2020, supporting a major smartwatch manufacturer
Lisle, IL – June 23, 2022 – Molex, a global electronics leader and connectivity innovator, today announced the commercial availability of Molex Quad-Row Board-to-Board Connectors , which feature an industry-first staggered circuit layout that saves 30% space over traditional connector designs. These patent-pending connectors provide product developers and device manufacturers with greater freedom and flexibility to support compact form factors, including smartphones, smartwatches, wearables, gaming consoles, and augmented reality/virtual reality (AR/VR) devices.
“Molex continues to drive connectivity innovation to enable smaller, more powerful devices,” said Justin Kerr, vice president and general manager of Molex’s Micro Solutions business unit. “With the highly dense Quad-Row board-to-board connector, our customers can now squeeze more features, sensors and functionality into tighter and tighter spaces without compromising device performance. As a result, Molex is setting a new connectivity standard for space optimization.”
The first staggered circuit layout brings unprecedented space savings
Molex's long-term collaboration with product developers at a major smartwatch manufacturer led to the initial design of the Quad-Row board-to-board connector. Molex engineers also worked with experts at a global leader in the design, development and manufacture of flexible printed circuits (FPCs). The engineering teams worked together to verify the pioneering staggered circuit layout, arranging four rows of pins with a signal contact pitch of 0.175 mm. The result is unprecedented space savings while achieving high-density circuit connections.
The Quad-Row board-to-board connector adheres to a 3.0A current rating, meeting customer requirements for high power in a compact structure. In addition, the product meets the standard soldering pitch of 0.35 mm and uses typical surface mount technology (SMT) processes to speed up mass production. Thanks to the internal armor and inserted power pins, strong and reliable performance is ensured, protecting the pins from damage during mass manufacturing and assembly. These features, coupled with a wide array, facilitate quick and safe engagement and reduce the rate of shedding.
Mass production, diverse application portfolio
Since 2020, more than 50 million Quad-Row connectors have been shipped to support the production of the world's best-selling smartwatches. Molex's meticulous attention to manufacturing design has accelerated mass production. The connector also supports larger reel sizes, which can improve production efficiency and thus increase production yields.
In addition, the Quad-Row board-to-board connector is compact in size and reliable in performance, making it ideal for a variety of applications that require smaller and smaller printed circuit boards and flexible components. Because it can meet the needs of product miniaturization, it can create unlimited opportunities for augmented reality/virtual reality, automotive, communications, consumer, defense, Internet of Things, medical and wearable applications.
Availability
Molex Quad-Row board-to-board connectors are available globally in 32- and 36-pin configurations, with 20- and 64-pin configurations coming soon. Support for up to 100-pin configurations is also planned.
Molex Consumer and Commercial Solutions
Molex has proven expertise in 5G, mmWave, RF, signal integrity, antennas, power, cameras and display technologies , providing critical connections for the entire mobile device ecosystem. Advantages such as precision, volume manufacturing and miniaturization enable Molex to meet changing market demands and provide leading mobile device manufacturers and their suppliers with the smallest, densest and most advanced connectors currently available on the market.
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