Henkel launches 10.0 W/mK ultra-high thermal conductivity gel to address thermal management challenges in high-bandwidth systems

In response to the increasingly challenging thermal management needs of data communications, telecommunications and industrial automation applications, Henkel recently announced the commercialization of its latest thermal interface material (TIM) BERGQUIST® LIQUI FORM TLF 10000 gel . This single-component, highly thermally conductive gel can be dispensed to provide powerful heat transfer effects for high-power electronic components, thereby improving the operating efficiency of the system and improving its reliability throughout its entire life cycle.

Large, high-power devices such as ASICs and FPGAs are standard for 5G telecom infrastructure equipment, data center switches, routers, and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase to meet the demands of faster data processing and digitization, reliable performance can only be achieved by controlling the thermal output of high power. With a thermal conductivity of up to 10.0 W/mK, BERGQUIST LIQUI FORM TLF 10000 thermally conductive gel is ideal for a wide range of applications where reliability is critical and extreme environments are unpredictable.

IDTechEx Senior Technology Analyst Dr. James Edmondson believes that easy-to-process high thermal conductivity materials are indispensable and can help bridge production and performance expectations. He said: "Digitalization, data-driven control across different market sectors has driven the rise of high-power density component design, which can achieve excellent processing speeds. It covers a wide range of applications - from 5G baseband units in urban areas to small cells and Wi-Fi 6E routers, to electric vehicles, as well as artificial intelligence and robotics. These applications require reliable thermal management solutions to withstand changing environments, positioning uncertainties and high power. Our research confirms the market demand for dispensable, high-thermal conductivity thermal interface materials (TIMs) that can well meet current performance and volume processing requirements. Thermally conductive gels have proven to be an effective solution."

BERGQUIST LIQUI FORM TLF 10000 not only has excellent thermal conductivity, but this silicone material also meets many other requirements for high-reliability electronic equipment mass production. Its specific advantages are:

• Reliability : 0.5-1.5mm gap with high stability and excellent thermal cycling capability.

• Heat Transfer : Thermal impedance as low as 0.45 Kcm2/W at 0.5 mm interface thickness; thermal conductivity as high as 10.0 W/mK.

• Short production cycle and less waste: dispensing is fast and easy, compatible with various dispensing equipment; stable viscosity, reducing material waste.

• Low Stress: Dispensing pressure and assembly forces are low, resulting in less stress on components.

Wayne Eng, head of global market strategy for Henkel's Communications & Data Center business, concluded: "Fast data transfer and instant access to information are essential to modern life . Components and systems are becoming increasingly powerful to meet high bandwidth and data processing demands, and their reliable performance relies on optimized functionality. Henkel has developed a unique TIM gel solution that is nearly twice as thermally conductive as its previous generation while balancing excellent heat dissipation with flexible production requirements. We are an industry leader in TIM gels and will continue to innovate to meet future market demands for next-generation product performance."