1 Establishment of the physical model of the diode in the Spice program
In the Spice program, the schematic diagram of the physical model of the diode is shown in Figure 1, where Rs is the material resistance of the diode, called ohmic resistance; CD is the equivalent capacitance caused by the charge storage effect; ID is a nonlinear current source.
The relationship between the nonlinear current source ID and the voltage UD applied across it is as follows:
Where: Is is the saturation current (unit: A); q is the electron charge (1.062×10-19C); K is the Boltzmann constant (1.38×10-23J/K); T is the thermodynamic temperature (unit: K); n is the emission coefficient (1.2~2.0 for silicon tube); VB is the reverse breakdown voltage (unit: V); IVB is the current during reverse breakdown (unit: A). The Spice program adds a small conductance Gmin to the PN junction of the diode. Its implicit value is 10-12S. Under normal circumstances, the existence of Gmin will not affect the normal characteristics of the diode. The
charge storage effect of the diode includes two parts. One part is the charge stored on the PN junction barrier capacitance, which is equal to the integral of the barrier capacitance to the PN junction voltage; the other part is the charge storage formed by the injection of minority carriers, which is proportional to the forward current. The total charge storage QD is:
Where: τD is the transit time of minority carriers; Cjo is the depletion layer capacitance of the PN junction at zero bias; φD is the self-built potential of the PN junction, and the typical value for the junction diode is 0.7~0.8 V; FC is the coefficient of the forward bias depletion capacitance formula, and the typical value is 0.5.
The diode equivalent capacitance CD is composed of two parts: one is the diffusion capacitance Cs generated by the charge storage injected by minority carriers, and the other is the depletion capacitance Cd generated by the charge storage of the PN junction depletion layer, namely:
2 The influence of temperature change on the volt-ampere characteristics of the Spice diode model D1N4002
A total of 14 diode model parameters are set in the Spice program. The parameters of the Spice diode model D1N4002 are shown in Table 1. These parameters are the values at room temperature (27℃).
The above formulas are all calculated at room temperature, which is 27℃ (300 K) in the Spice program. However, many parameters in semiconductor devices are functions of temperature. In order to reflect the changes of parameters with ambient temperature, the Spice program provides temperature correction formulas for some parameters, such as Is, φD, CD, etc. The temperature correction formula for IS is:
For junction diodes, pt=3. For silicon diodes, Eg(300)=1.11eV.
Under the diode physical model, considering the influence of temperature on IS, the volt-ampere characteristic curve of the diode physical model is corrected using formula (10). Based on the
D1N4002 diode physical model, the diode volt-ampere characteristic curves at three temperatures of T1=300 K, T2=325 K, and T3=350 K are selected for comparative analysis.
Enter the instruction code of the volt-ampere characteristic curve of the simulated diode physical model in the command box of the simulation software Matlab, and obtain the diode volt-ampere characteristic curve as shown in Figure 2. The simulation test experimental measurement data is shown in Table 2. This is a set of volt-ampere characteristic curves of the D1N4002 diode physical model at different temperatures. It can be clearly seen from the simulation curve that the change in temperature has no obvious effect on the volt-ampere characteristic curve section of the diode reverse bias but not broken down. This is because the parameter values of IS and Gmin are very small, making the ID value on this curve section approach zero. It can be concluded from the diode forward bias curve in the figure that when the diode is forward biased, the increase in temperature will cause the diode's turn-on voltage Uon to decrease, and at the same time increase after forward conduction. When the diode is reverse biased and in a Zener breakdown state, it can be seen from the curve that as the temperature increases, the diode's reverse breakdown voltage VB decreases, and increases after reverse breakdown.
3 Effect of temperature change on equivalent capacitance of Spice diode model D1N4002
The temperature correction formulas for φD and CD in Spice program are:
Under the diode physical model, considering the effect of temperature on IS and φD, the relationship curve between equivalent capacitance CD and UD of the diode physical model is corrected using equations (10) and (11). Based on the D1N4002 diode physical model, the curves of equivalent capacitance CD changing with UD at three temperatures of T1=300 K, T2=325 K, and T3=350 K are selected for comparative analysis.
In the command box of the simulation software Matlab, input the instruction code for simulating the change of equivalent capacitance of the physical model of the simulated diode with voltage UD, and obtain the curve of the change of diode equivalent capacitance with voltage UD as shown in FIG3 . The simulation test experimental data is shown in Table 3.
This is a set of curves showing the change of diode equivalent capacitance with UD at different temperatures.
Combined with the analysis of the volt-ampere characteristic curve of the diode physical model in Figure 2, it can be seen from Figure 3 that since the current flowing through the diode is very small and almost negligible when the diode is reverse biased and not reversely broken down, the equivalent capacitance of this section approaches zero, and the temperature change has a very small effect on the equivalent capacitance curve in this section. When forward conduction or reverse breakdown occurs, the current flows through the diode, and the equivalent capacitance of the diode increases sharply with the increase of UD.
When the temperature rises, the equivalent capacitance of the diode increases, and the value of also increases with the increase of temperature, and the slope of the equivalent capacitance curve is positively correlated with.
4 Conclusion
The change of temperature has little effect on the volt-ampere characteristics and equivalent capacitance of the diode in the reverse biased non-breakdown or forward biased non-conduction state, which can be almost ignored. However, in the forward conduction and reverse Zener breakdown states, the change of temperature has a significant effect on the volt-ampere characteristics and equivalent capacitance of the diode physical model. The increase in temperature causes the turn-on voltage and reverse breakdown voltage of the diode physical model to increase, the current to increase, and the rate of change of the current to the voltage UD in the volt-ampere characteristic curve to increase. The increase in temperature also causes the equivalent capacitance of the diode to increase, and the rate of change of the equivalent capacitance of the diode to the voltage UD to increase.
Previous article:Introduction to Anti-interference Technology of Active Power Filter (APF)
Next article:ADI Smart Grid Complete Solution
Recommended ReadingLatest update time:2024-11-17 02:58
- Popular Resources
- Popular amplifiers
- Modern Electronic Technology Training Course (Edited by Yao Youfeng)
- Sensor Principle and Application Circuit Design (Edited by Chen Shuwang, Song Lijun, Xu Yunfeng)
- Single-chip microcomputer C language programming and simulation
- 100 Examples of Microcontroller C Language Applications (with CD-ROM, 3rd Edition) (Wang Huiliang, Wang Dongfeng, Dong Guanqiang)
- MathWorks and NXP Collaborate to Launch Model-Based Design Toolbox for Battery Management Systems
- STMicroelectronics' advanced galvanically isolated gate driver STGAP3S provides flexible protection for IGBTs and SiC MOSFETs
- New diaphragm-free solid-state lithium battery technology is launched: the distance between the positive and negative electrodes is less than 0.000001 meters
- [“Source” Observe the Autumn Series] Application and testing of the next generation of semiconductor gallium oxide device photodetectors
- 采用自主设计封装,绝缘电阻显著提高!ROHM开发出更高电压xEV系统的SiC肖特基势垒二极管
- Will GaN replace SiC? PI's disruptive 1700V InnoMux2 is here to demonstrate
- From Isolation to the Third and a Half Generation: Understanding Naxinwei's Gate Driver IC in One Article
- The appeal of 48 V technology: importance, benefits and key factors in system-level applications
- Important breakthrough in recycling of used lithium-ion batteries
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- Rambus Launches Industry's First HBM 4 Controller IP: What Are the Technical Details Behind It?
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- MSP430 FRAM Microcontrollers Enable Energy Harvesting
- [RVB2601 Creative Application Development] Experience Sharing 2: Lighting in Multiple Ways, Component Learning
- Desktop robot dog
- CC2640R2: A brief analysis of BLE pairing mechanism and implementation of custom pairing password
- E22-400TBL-01 LoRa module test version +01 unboxing
- How to process the signal of BLDC feedback speed measuring motor
- [Evaluation of EVAL-M3-TS6-665PN development board] 4. Drive motor
- FQP20N60 FET alternative model, improves the voltage regulation effect of high voltage H-bridge PMW motor drive!
- How can GPS ceramic antenna receive better signals?
- 【Topmicro Intelligent Display Module】V. Interact with the screen via the network