For electronic products, protection circuits are used to prevent critical sensitive components in the circuit from being damaged by shocks such as overcurrent, overvoltage, and overheating. The quality of protection circuits is critical to the quality and life of electronic products. As the demand for consumer electronic products continues to grow, more robust electrostatic discharge (ESD) protection is required, while reducing unnecessary electromagnetic interference (EMI)/radio frequency interference (RFI) noise. In addition, consumers expect the latest consumer electronic products to meet increasingly high download and bandwidth capabilities with small-sized devices. As devices become smaller and more integrated, ESD and, in many cases, EMI/RFI suppression can no longer be included in the new generation of ICs that drive the required interfaces.
In addition, advanced system-on-chip (SoC) designs are manufactured using processes with very small geometric dimensions. In order to optimize functions and chip size, IC designers have been continuously reducing the minimum size of the functions they design. The reduction in IC size has made devices more susceptible to ESD voltage damage.
In the past, it was sufficient for designers to select a protection product that met the IEC61000-4-2 specification. Therefore, the data sheets of most protection products only include compliance rating requirements. As integrated circuits become more sensitive, newer designs have protection components to meet standard ratings, but ESD strikes can still create excessive voltages that can damage the IC. Therefore, designers must select one or more protection products that not only meet the ESD pulse requirements, but also clamp the ESD strike to a low enough voltage to ensure that the IC is protected.
Figure 1: ESD protection requirements of the Electrostatic Discharge Association (ESDA) of the United States
Advanced Technology for Robust ESD Protection
ON Semiconductor's ESD clamping performance is highly regarded in the industry, and clamping performance can be observed and quantified in several ways. Several standard tools can be used to measure the ESD clamping capabilities of standalone ESD protection devices or integrated devices, including ESD protection functions. The first tool is the ESD IEC61000-4-2 ESD Pulse Response Screenshot, which shows the clamping voltage response over time, which can show the downstream devices during the ESD event.
Figure 2: ESD Clamp Screenshot
In addition to the ESD clamping screenshot, another method is to measure the transmission line pulse (TLP) to evaluate the ESD clamping performance. Since an ESD event is a very short transient pulse, TLP can measure current vs. voltage (IV) data, where each data point is obtained from a short square pulse. TLP IV curves and parameters can be used to compare the properties of different TVS devices and can also be used to predict the ESD clamping performance of a circuit.
Figure 3: Typical TLP IV curve diagram
There are two types of high-speed interface ESD protection protection device lineups provided by ON Semiconductor. The first type is the easiest to implement and is called traditional design protection. In this type of design, the signal line runs under the device. These devices are usually the lowest capacitance products.
Figure 4: Comparison of traditional methods and PicoGuard® XS design methods
ON Semiconductor's protection and filtering solutions are based on traditional silicon chip process technology. In contrast, other types of low-cost passive solutions use materials such as ceramics, ferrites, and multilayer varistors (MLVs). Such devices generally have poor ESD clamping performance. In some cases, the energy delivered to downstream devices may be an order of magnitude lower than that of ON Semiconductor solutions. Some products using older technology may even degrade and become worse after a small amount of ESD strikes. Due to the nature of their materials, some passive components tend to show temperature inconsistencies, which reduces the reliability of the end system operating within the standard consumer temperature and ambient temperature range.
Other characteristics must be considered .
ESD and EMI solutions prevent unwanted signals from interfering with the overall performance of the system. During normal system operation, the protection device must also maintain good signal integrity for a given interface, in other words, it should be completely "transparent". ON Semiconductor's devices are suitable for operating and protecting today's most common consumer electronic system interfaces. Typically, the impact of signal integrity is measured using S-parameter insertion loss curves, and filter solutions can also measure the response of the filter. Eye diagrams can also be used to measure signal integrity (especially for high-speed devices) to prove the maximum data rate that can be achieved by the device during normal operation without interference.
ON Semiconductor has two basic types of EMI filters. The first type is a single-ended low-pass filter in various array configurations for parallel interfaces; it is divided into traditional and general-purpose resistor-capacitor (RC) versions, and inductor-capacitor (LC) versions for high-speed and power-sensitive interfaces.
Figure 5: Single-ended low-pass filter characteristics
According to the specifications, each component has a passband range. These devices can cut off high frequencies ranging from 700 MHz to 6 GHz.
The second type of EMI filter is suitable for high-speed serial interfaces and has the function of exceeding the typical low-pass filter. This type of interface is a differential signal path with inherent noise suppression, but it will not be completely immune to common-mode noise from external sources or block interface signals from radiating to other parts of the system.
Figure 6: Common Mode Filter (CMF) Characteristics
Protected common mode filters (pCMF) can be used to eliminate unwanted common mode noise and prevent radiated harmful common mode noise signals from entering other parts of the system from high-speed interfaces. At the same time, it can also make high-speed data channels almost undisturbed.
In addition to ESD strike protection, ON Semiconductor also provides solutions to protect against surge strikes caused by lightning strikes or power cross faults. A common interface in various consumer electronics and telecommunications/networking equipment is the RJ45 interface that complies with the 10/100BASE-T and 1000BASE-T Ethernet protocols, and its surge rating is often the indoor standard. These interfaces consist of four pairs of differential data lines, each of which can transmit data rates of up to 250 Mbps. Protection for such interfaces needs to ensure that lateral (metallic) surge strikes do not damage sensitive downstream chips (such as the physical layer). This is achieved by connecting shunt protection elements to the line-to-line (each pair of lines) to divert the incoming surge energy.
For lower data rate (10/100BASE-T) applications, ON Semiconductor offers a combination of crowbar devices called TSPDs (thyristor surge protection devices), and clamping devices for similar ESD protection. TSPDs offer the advantage of low clamping voltages with higher surge current capabilities. For example, these devices can meet the requirements of the GR-1089 10/1000 μs standard and are therefore suitable for primary or secondary side protection, also known as “line end” protection. TVS (transient suppression diode) clamping devices support surge levels of 8/20 μs pulses and are typically used on the tertiary or PHY side to capture and safely eliminate any residual surge pulses.
Typical circuit protection application examples
Smartphone applications are a typical protection application. ON Semiconductor's solutions include data filters, ESD protection diodes and arrays, and voltage protection devices. USB2.0 protection for consumer and portable applications includes high-speed pairs, VCC, and low-capacitance ESD protection; USB 3.0 has two super-speed pairs and one high-speed pair, as well as VCC and low-capacitance ESD protection. The eSATA interface has two high-speed pairs and low-capacitance ESD protection.
Figure 7: Smartphone block diagram and I/O interfaces that need protection (see the light blue background area on the lower right)
For parallel interfaces of 4 to 12 lines for cameras and displays, ON Semiconductor has low-pass LC filters + ESD protection devices, as well as common-mode filters + ESD protection for 3 to 5 high-speed serial channels. For portable HDMI, consumer HDMI/display ports, four high-speed pairs, up to 6 additional interface lines, and low-capacitance ESD + common-mode filter solutions can be used.
In addition, ON Semiconductor's protection applications also include audio (speakers/headphones), SD interfaces, SIM cards, keyboard EMI suppression, Ethernet, and T1/E1, T3/E3 and xDSL ports, etc., which can meet the higher requirements of consumer electronic products for strong ESD protection and EMI/RFI noise reduction.
Powerful ESD protection and EMI filtering product lineup for portable and consumer application interfaces
ON Semiconductor, as the world's leading silicon solution supplier for energy-efficient electronic products, ranks first in the circuit protection market and provides a wide range of ESD protection and EMI/RFI filtering products for portable and wireless, consumer, computer and peripherals, automotive and telecommunications markets. Table 1 and Table 2 list ON Semiconductor's ESD protection and EMI filtering solutions for portable application interfaces and consumer application interfaces, respectively. Customers can choose the appropriate solution according to actual application requirements.
Table 1: ON Semiconductor Portable Application Interface ESD Protection and EMI Filtering Solutions
Table 2: ON Semiconductor Consumer Application Interface ESD Protection and EMI Filtering Solutions
Summary:
ON Semiconductor is a global leader in circuit protection. Its leading ESD protection products include: the traditional ESD protection solution with the lowest capacitance and extremely low clamping voltage in the industry; the first PicoGuard XS protection solution on the market that is equivalent to providing zero capacitance; and the common mode filter solution with integrated ESD protection, which is also the first on the market. These highly integrated protection solutions help customers protect the increasingly high-speed sensitive chipsets in their products and reduce the space occupied by circuit boards.
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